ATS-11G-181-C3-R0

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Thermal - Heat Sinks are designed to provide efficient cooling of electronic components and systems. The ATS-11G-181-C3-R0 is one type of thermal-heat sink capable of dissipating generated heat to the surrounding environment and providing thermal stability and reliability to the system. This heat sink comes in two configurations, a straight box type with aluminum fins and a t-bar type with copper fins.

The ATS-11G-181-C3-R0 thermal-heat sink uses a finned aluminum base to provide maximum thermal efficiency and reliable Cooling. The fins act as a secondary heat exchanger, providing efficient heat spread or utilization of the surrounding air. The aluminum fins are welded to a base and then anodized to resist corrosion. The aluminum fins which increase the surface area for cooling also create more efficient heat flow. The fins are spaced even distances apart to ensure air flow resistance is kept to a minimum.

The ATS-11G-181-C3-R0 thermal-heat sink features a three-part, low-profile construction to allow for easy installation and maintenance. The first part consists of a base plate made of die cast aluminum. The second part consists of an assembly of aluminum fins and an aluminum heat spreader plate. The third part consists of a top plate made of steel. The heat spreader plate serves to spread the generated heat from most of the components and through the fins into the environment. The top plate features a rubber-plated lip for gripping and easier installation. The heat sink is designed to be used in either horizontal or vertical orientation.

The ATS-11G-181-C3-R0 thermal-heat sink is designed to be used in a variety of different applications. It is commonly used in telecommunications, automotive electronics, industrial automation, medical devices, and consumer electronics. It is also suitable for use in any electronic device that requires adequate and reliable thermal management. The heat sink is designed for high-power or high-heat applications such as power supplies, inverters, and servo amplifiers. It can also be used for cooling electronic components like cooling fans, CPUs, and motherboards. Additionally, the heat sink can be used for cooling LED lighting modules.

The ATS-11G-181-C3-R0 thermal-heat sink works by transferring the heat generated by the components to the surrounding environment through the finned housing of the heat sink. Heat is generated by electronic components due to their increasing power levels and switching operations. The heat generated is then transferred away from the components and into the heat sink by conduction. The heat is then dissipated into the environment by convection, which is the transfer of heat from a hotter element to a cooler one through the air. The wider surface area of the fins, along with the flow of air from the surrounding environment, facilitates heat spread and dissipation.

The ATS-11G-181-C3-R0 thermal-heat sink is an efficient, reliable, and cost-effective solution for cooling electronic components and systems. It is capable of dissipating large amounts of heat and providing thermal stability and reliability to the system. The wide range of applications and three-parts design make it a versatile and flexible cooling solution. The aluminum fins offer increased surface area for better heat spread, while the low-profile construction allows for easy installation and maintenance. The ATS-11G-181-C3-R0 thermal-heat sink is an ideal choice for many electronic applications.

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