| Allicdata Part #: | ATS19779-ND |
| Manufacturer Part#: |
ATS-11G-191-C2-R0 |
| Price: | $ 4.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-191-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.44780 |
| 10 +: | $ 4.32621 |
| 25 +: | $ 4.08568 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays a key role in the performance and reliability of electronic systems. A thermal-heat sink is a device that absorbs and dissipates heat from a system and helps maintain its optimal temperature level. The ATS-11G-191-C2-R0 thermal-heat sink is a state-of-the-art heat sink designed for use with high-powered and demanding electronic systems.
The ATS-11G-191-C2-R0 is an energy-efficient thermal-heat sink that helps protect the internal components of a system by absorbing and dissipating heat. It features a unique finned and grooved design, which helps to maximize the surface area and heat transfer effectiveness. This design also helps to reduce noise levels and improve airflow. The ATS-11G-191-C2-R0 is compatible with a variety of electronic devices, including LEDs, CPUs, GPUs, and disk drives.
The ATS-11G-191-C2-R0 uses a passive heat-dissipating design to help manage the heat within a system. Its finned and grooved design helps to maximize the surface area available for heat exchange, which leads to a faster and more efficient heat-dissipation process. The grooves in the design also increase the air-flow to improve the efficiency of the heat dissipation. It also has an optimized fanless design, which eliminates the need for external fans and reduces system noise.
The ATS-11G-191-C2-R0 provides a reliable thermal-heat sink solution for a variety of applications in the electronics field. Its state-of-the-art design helps provide uniform temperature distribution and improved heat transfer. It is ideal for use in applications such as storage systems, LED systems, computer systems, and other demanding applications. The lightweight design and wide compatibility of the ATS-11G-191-C2-R0 also make it an ideal solution for baked-in thermal solutions.
The ATS-11G-191-C2-R0 is designed to deliver outstanding thermal performance, reliability, and cost efficiency. It uses a finned and grooved surface to maximize the surface area available for heat exchange, which leads to faster and more efficient heat dissipation. The ATS-11G-191-C2-R0 is designed to provide uniform temperature distribution and improved heat transfer, and its passive heat-dissipating design helps to manage the heat within the system. The lightweight and wide compatibility of the ATS-11G-191-C2-R0 make it an ideal solution for many applications in the electronics field.
The specific data is subject to PDF, and the above content is for reference