| Allicdata Part #: | ATS19788-ND |
| Manufacturer Part#: |
ATS-11G-20-C2-R0 |
| Price: | $ 4.98 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-20-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.52970 |
| 10 +: | $ 4.40685 |
| 25 +: | $ 4.16203 |
| 50 +: | $ 3.91734 |
| 100 +: | $ 3.67246 |
| 250 +: | $ 3.42763 |
| 500 +: | $ 3.18280 |
| 1000 +: | $ 3.12159 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
Heat sinks have become increasingly important over the last few decades as technology has advanced. Heat sinks improve the efficiency of electronic components and help them run cooler. This type of device, known as a thermal management system, works by dissipating the heat created by the components.
ATS-11G-20-C2-R0
The ATS-11G-20-C2-R0 is a heat sink designed for use in electronic applications. It is designed to manage the dissipation of heat from electrical components in a variety of environments. The heat sink is made of extruded aluminum and is designed to provide thermal resistance by trapping and dispersing heat created by components. It has a heat dissipation rating of 11W/in2 and is designed to be used in a variety of applications such as high-power computer systems, servers, coolers, and lighting systems.
Application Field
The ATS-11G-20-C2-R0 is designed for use in a variety of applications. It is primarily used to manage thermal resistance for high-power computer systems and servers, but it can also be used for other applications, such as lighting systems and coolers. Its high heat dissipation rating means it can effectively dissipate large amounts of heat quickly, making it an ideal choice for applications that produce a lot of heat.
Working Principle
The ATS-11G-20-C2-R0 works by trapping and dispersing the heat created by components. The extruded aluminum used to make the device traps and absorbs heat, preventing it from building up in the device and dissipating it away from the component. This process helps prevent system components from becoming too hot and maintains their performance. The aluminum also serves to dissipate the heat generated away from the system and off into the atmosphere, allowing the component to remain at a steady temperature.
Conclusion
The ATS-11G-20-C2-R0 is a heat sink designed for use in a variety of electronic applications. Its extruded aluminum construction traps and displaces heat to prevent components from overheating, and its high heat dissipation rating makes it an ideal choice for applications that generate a lot of heat. It is an invaluable tool for managing the temperature of electrical systems and for keeping components running at their best.
The specific data is subject to PDF, and the above content is for reference