ATS-11G-20-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-11G-20-C3-R0-ND

Manufacturer Part#:

ATS-11G-20-C3-R0

Price: $ 4.67
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11G-20-C3-R0 datasheetATS-11G-20-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.19895
30 +: $ 3.96543
50 +: $ 3.73225
100 +: $ 3.49896
250 +: $ 3.26570
500 +: $ 3.03243
1000 +: $ 2.97412
Stock 1000Can Ship Immediately
$ 4.67
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management plays an essential role in all kinds of applications. In most cases, an electronic device will generate heat as a byproduct of its normal operations. Overheating can lead to significant system reliability issues, as well as limits the device\'s efficiency and longevity. The ATS-11G-20-C3-R0 is a thermal - heat sink that provides effective thermal management solutions by cooling and dissipating heat quickly and safely from electronic systems.

The ATS-11G-20-C3-R0 is a compact, low profile heat sink that features 20mm fins for optimal thermal performance. It is designed to provide maximum thermal performance in applications where space is an issue, such as automotive electronics, LED lighting, networking and industrial equipment. The anodized aluminum construction ensures that it is resistant to corrosion and abrasion.

Because of its unique design, the ATS-11G-20-C3-R0 is able to quickly dissipate heat from electronic devices, protecting them from damage. It is made up of an attached baseplate, which is essential in providing superior thermal management. This baseplate utilizes Pin Fin technology, which maximizes thermal efficiency and surface area contact to quickly and safely dissipate heat. The baseplate also features heating fins, which help to efficiently transfer the heat away from the device.

The ATS-11G-20-C3-R0 is able to dissipate heat quickly and safely from electronic systems in a variety of applications. It is ideal for automotive electronics, LED lighting, networking, industrial equipment, medical devices and much more. Its compact design makes it a perfect fit for these applications, where space is often a limiting factor.

Its unique design is not only optimized for thermal performance but also makes the ATS-11G-20-C3-R0 extremely reliable. It features a die-cast aluminum construction, which is lightweight and extremely tough. This makes it resistant to damages caused by wear and tear or extreme temperatures. It also features fasteners that provide extra security and stability, so it can withstand the harshest conditions.

The ATS-11G-20-C3-R0 is an effective and affordable solution for optimizing the thermal management of any electronic system. It provides superior thermal performance that quickly and safely removes heat from the system, protecting it from damage and ensuring system reliability. Its unique design also ensures that it is durable and reliable, making it an ideal choice for applications where space is an issue.

The specific data is subject to PDF, and the above content is for reference

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