ATS-11G-210-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks have been around for generations, in one form or another. But a heat sink\'s importance has grown with the development of efficient and powerful electronics. It is especially important in these days of cutting-edge digital products that require a steady supply of power but generate immense amounts of heat. Without a proper heat sink to keep the system cool, the products may be damaged and cease to work. ATS-11G-210-C1-R0 is one such heat sink designed to help ensure efficient and reliable electronics operation.

ATS-11G-210-C1-R0 is an aluminum extruded profile heat sink specifically designed for cooling electronics. Its necked design provides maximum surface area from a minimal space. The heat sink has a platform top and bottom with straight fins throughout its length. The fins come in a variety of shapes including round, rectangular, and arced, each with their own special purpose.

The purpose of ATS-11G-210-C1-R0 is to remove excess heat generated by the electronics components it cools. Heat is removed from the components via convection, in which the hot air from within the component is forced out of the system by the cooler air that is drawn in through the fins on the heat sink. The fins act as a heat exchange system as they draw cooler air from the environment to the heated air from within the components. The resulting cooling effect allows the components to work at peak efficiency.

ATS-11G-210-C1-R0 is specifically designed to dissipate the heat generated by a variety of components including CPUs, GPUs, DSPs, FPGAs, ASICs, and other electronic components. Its platform top and bottom design makes it possible to combine two or more heat sinks together to form larger systems. This is beneficial in applications where multiple components with different thermal loads require cooling, such as a motherboard or large processor board.

The length of the ATS-11G-210-C1-R0 heat sink is optimized to ensure maximum cooling performance and durability. It is constructed from extruded aluminum, making it both lightweight and designed to dissipate heat effectively. Its fins are designed to allow for efficient airflow, increasing heat dissipation and air circulation around the cooled components.

Although ATS-11G-210-C1-R0 is a thermal-based heat sink, its application can go beyond cooling electronics. It is designed to provide efficient direct or forced air cooling for a variety of applications including machinery, electronic cabinets, and even LED lighting. This makes it a versatile product that can be used in a variety of environments.

The ATS-11G-210-C1-R0 heat sink is designed to provide superior thermal-heat dissipation in order to ensure efficient and reliable operation of electronic components. Its platform top and bottom design, lightweight construction, and various fin shapes make it an ideal choice for many applications in need of effective thermal-heat management. With its versatility, ATS-11G-210-C1-R0 is an ideal thermal-heat solution for a variety of applications.

The specific data is subject to PDF, and the above content is for reference