ATS-11G-23-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.06°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat sinks are a critical component of many electronics devices. They help to dissipate heat generated from components that can not operate at their optimal temperature levels and can prevent catastrophic failure due to heat-induced stress and subsequent component degradation. The ATS-11G-23-C3-R0 is a cost-effective, high-performance heat sink designed to improve the reliability of components in a range of applications.

Application Field

The ATS-11G-23-C3-R0 can be used in a variety of applications including, but not limited to, hot-swapping, cooling high-powered devices, telecommunications products, outdoor lighting systems, automotive electronics, and power supplies. This heat sink can also be used in industrial automation and medical systems.

Heat Sink Configuration

The ATS-11G-23-C3-R0 is a two-part heat sink designed to provide efficient cooling. Its housing is made of aluminum and features embedded copper fins for increased heat dissipation. The ATS-11G-23-C3-R0 also has a built-in metal mounting plate to secure it to a variety of surfaces.

Thermal Application & Working Principle

The ATS-11G-23-C3-R0 operates on the principle of convection cooling. Heat generated by a device is transmitted through a material and then travels through air or a fluid to a heat sink. The heat sink\'s embedded fins provide an increased surface area for improved heat transfer which helps to dissipate the heat away from the device.For optimal operation, it is important to ensure the air or fluid flow is sufficient for efficient heat transfer. This can be achieved by either natural convection (air) or forced convection (liquid/air). The ATS-11G-23-C3-R0 is capable of working both ways, but its performance may vary with different systems.The ATS-11G-23-C3-R0 has a low profile design which ensures it doesn\'t protrude from a system\'s design. It is designed to be mounted securely and features a pre-prepared thermal interface. This ensures optimal heat transfer with minimal thermal losses.

Conclusion

The ATS-11G-23-C3-R0 is a versatile, cost-effective solution for high performance heat sinks. It features an efficient heat transfer mechanism and is designed to be low-profile and securely mounted. It can be used in a variety of thermal applications and can be tailored to accommodate different working conditions. With its ease of assembly and improved reliability, the ATS-11G-23-C3-R0 is an ideal choice for a wide range of projects.

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