| Allicdata Part #: | ATS-11G-30-C1-R0-ND |
| Manufacturer Part#: |
ATS-11G-30-C1-R0 |
| Price: | $ 7.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-30-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.62760 |
| 30 +: | $ 6.25947 |
| 50 +: | $ 5.89138 |
| 100 +: | $ 5.52315 |
| 250 +: | $ 5.15494 |
| 500 +: | $ 4.78673 |
| 1000 +: | $ 4.69468 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11G-30-C1-R0 is a thermal heat sink designed to dissipate heat by utilizing a combination of material properties and air movement. The heat sink consists of a metallic heat spreader that is thermally coupled to a baseplate and a fin array. This structure allows the heat generated by the component to be effectively spread to a large area, and then transferred to the airflow passing through the fin array. A larger exposed surface area and higher volume of airflow improves the heat dissipation capacity of the heat sink. The design also provides a degree of protection by preventing components from overheating and failing.
Heat sinks are often divided into two categories: active and passive. ATS-11G-30-C1-R0 is a passive heat sink, which is typically powered by only a fan or other cooling mechanism. This type of heat sink utilizes the properties of materials to absorb and dissipate heat, as well as air gaps through which airflow can pass to transfer the heat away from the component. The fin array and heat spreader enhance the cooling performance by increasing the air flow and exposed surface area.
The ATS-11G-30-C1-R0 features optimized geometry, designed to maximize air movement and heat transfer. The heat spreader is made from a metal alloy that provides good thermal conductivity and is plated with a corrosion resistant finish to protect the surface. The fins are made from aluminum for lightweight and high-performance thermal conductivity, and feature grooves and channels to increase surface area and airflow.
The ATS-11G-30-C1-R0 heat sink offers superior performance in a wide range of applications. It is suitable for use in power supplies, processors, and other components that generate heat. It is also ideal for automotive, industrial, and military applications where reliable cooling is required.
The ATS-11G-30-C1-R0 is easy to install and requires minimal maintenance. A single mounting bracket is included, which makes installation quick and simple. The heat sink is highly durable, and its corrosion resistant finish provides additional protection against wear and tear.
In conclusion, the ATS-11G-30-C1-R0 is a highly effective thermal heat sink that provides superior cooling performance for a wide range of applications. It is easy to install, durable, and requires minimal maintenance. With its optimized geometry and corrosion resistant finish, the ATS-11G-30-C1-R0 is an excellent choice for all your cooling needs.
The specific data is subject to PDF, and the above content is for reference