ATS-11G-42-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS-11G-42-C2-R0-ND

Manufacturer Part#:

ATS-11G-42-C2-R0

Price: $ 7.15
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X60.96X22.86MM T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11G-42-C2-R0 datasheetATS-11G-42-C2-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 6.43104
30 +: $ 6.07383
50 +: $ 5.71662
100 +: $ 5.35928
250 +: $ 5.00200
500 +: $ 4.64471
1000 +: $ 4.55539
Stock 1000Can Ship Immediately
$ 7.15
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 2.400" (60.96mm)
Diameter: --
Height Off Base (Height of Fin): 0.900" (22.86mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.31°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks: ATS-11G-42-C2-R0 Application Field and Working Principle

The ATS-11G-42-C2-R0 is an efficient heat dissipation device designed to help keep temperature-sensitive components running at optimal temperatures. Manufactured with both aluminum and copper in an environmentally friendly green material, it reliably manages the heat load generated by a variety of components and systems. To maximize its cooling capabilities and longevity, it is important to understand the ATS-11G-42-C2-R0 application field and working principle.

Application Field

The ATS-11G-42-C2-R0 can dissipate heat from an extensive range of components and systems. From processors and graphics cards to motherboards and gaming consoles, the ATS-11G-42-C2-R0 is capable of cooling temperatures for a wide variety of applications. It is best suited for systems that generate large amounts of heat, such as high performance gaming computers, servers, and industrial equipment. In addition, it is able to be used in cases with limited or no air ventilation due to its efficient heat dissipation capabilities.

Working Principle

The ATS-11G-42-C2-R0 utilizes two layers of highly conductive metal to dissipate heat in two stages. The first layer, made of copper, quickly absorbs the heat from the component or system. This copper layer is then cooled by the second layer, which is made of aluminum. The aluminum rapidly reduces the copper’s temperature to prevent heat damage. The aluminum layer’s thermal conductivity is also higher than copper, meaning that it can absorb more heat before becoming overloaded.

To further improve its cooling capabilities, the ATS-11G-42-C2-R0 features a die-cast aluminum frame and high airflow. This provides an effective barrier that protects components from the heat generated by the copper and aluminum layers while allowing a large amount of air to pass through and reduce the device’s operating temperature. Additionally, the ATS-11G-42-C2-R0 utilizes a design that includes fins and cuts which help guide the air for maximum cooling.

Conclusion

The ATS-11G-42-C2-R0 is an efficient heat dissipation device that employs a combination of copper and aluminum layers to quickly absorb and dissipate heat from a range of components and systems. Its design includes a die-cast aluminum frame and high airflow to ensure optimal cooling capabilities. When utilized properly, the ATS-11G-42-C2-R0 is capable of keeping temperature-sensitive components and systems running at optimal temperatures.

The specific data is subject to PDF, and the above content is for reference

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