| Allicdata Part #: | ATS-11G-49-C1-R0-ND |
| Manufacturer Part#: |
ATS-11G-49-C1-R0 |
| Price: | $ 3.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-49-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.87721 |
| 30 +: | $ 2.79909 |
| 50 +: | $ 2.64361 |
| 100 +: | $ 2.48812 |
| 250 +: | $ 2.33264 |
| 500 +: | $ 2.25488 |
| 1000 +: | $ 2.02162 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management technology has experienced tremendous advancements in recent years, providing a wide range of design options for the modern engineer. One of the most important of these technologies is the ATS-11G-49-C1-R0 heatsink, which can be used to ensure sensitive electronic components such as microprocessors, operational amplifiers, and other critical components are not exposed to extreme temperatures.
The ATS-11G-49-C1-R0 heatsink is a compact aluminum extrusion heatsink designed for optimal heat dissipation, even in confined spaces. It features a unique fin array, which increases the effective top surface area and dissipates heat more efficiently. This type of heatsink is designed to dissipate heat from hot-spots and other areas with limited air flow.
The ATS-11G-49-C1-R0 heatsink is ideal for use in crowded electronic systems since its extremely small footprint allows it to be used in confined spaces. Its highly efficient fin array provides increased passive cooling that can be used in areas where other cooling solutions are not available or may be too costly. The heatsink can also be placed close to sensitive electronic components, thereby reducing the risk of exposure to any excessive temperatures.
The ATS-11G-49-C1-R0 heatsink is designed to dissipate heat through heat conduction. Heat is conducted from the component to the fins through the direct contact surface between the two. As the heat moves through the fins, it is dissipated into the ambient air. The fins increase the amount of conductive heat transfer due to their larger top surface area. As the fins draw away the heat, the cool air between them helps to maintain the temperature of the component.
The ATS-11G-49-C1-R0 heatsink is also designed for ease of installation. Typically, the heatsink requires no extra hardware for mounting and can easily be secured to the component. In some cases, the heatsink can even be mounted directly to a printed circuit board. The heatsink can also be used in areas with limited space, since the small footprint ensures that it is easy to work with and can fit in almost any electronic system.
The ATS-11G-49-C1-R0 heatsink is a great solution for protecting sensitive electronics and ensuring stable operation in even the most cramped areas. It is designed to dissipate heat efficiently and can also be installed quickly and easily. This type of heatsink is perfect for areas with limited air flow and for electronic components that need to be protected from extreme temperatures.
The specific data is subject to PDF, and the above content is for reference