ATS-11G-50-C1-R0

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Thermal management devices, such as ATS-11G-50-C1-R0, are responsible for dissipating thermal energy from the system. These devices perform the important task of transferring heat created by electronic components such as CPUs and GPUs, from the components to the surrounding environment. This allows the components to operate at their optimal temperature and prevents them from reaching dangerously high temperatures that can lead to damage or even complete failure.

Application Field

The ATS-11G-50-C1-R0 is a low profile thermal heat sink, which is used for dissipating heat generated from low profile electronic devices. It is ideal for applications such as notebook GPUs, server SoC, and industrial FPGA. It also can be used to cool mobile communication radios, base stations, and vehicle computers. The device is designed to be used in both indoor and outdoor settings, allowing for flexible application in a variety of settings.

The device\'s low profile design allows it to be used in applications where space is limited, while still providing maximum cooling efficiency. The heat sink has a profile of 11.5mm, making it one of the thinnest thermal management solutions available.

Working Principle

The ATS-11G-50-C1-R0 utilizes a combination of two types of heat dissipation, convection and condensation. Convection allows the heat from the electronic components to be transferred into the ATS-11G-50-C1-R0 via the heatsink thermal fin. The thermal fin then transfers the heat into the surrounding air, allowing it to be dissipated by a fan. Condensation then applies a second layer of heating, allowing the heat to be stored directly in the heatsink instead of being dissipated into the air.

The combination of convection and condensation provides the ATS-11G-50-C1-R0 with an effective cooling solution, allowing it to dissipate large amounts of heat quickly and efficiently. Furthermore, its low profile design ensures that it can be used in a variety of applications, allowing for maximum entropy while still providing efficient cooling.

The device features a copper base plate and aluminum fins that are designed for maximum heat dissipation. The heat sinks have a high operating temperature range of up to 140 degrees Celsius, meaning they can operate safely and effectively in high-heat environments. The device also has a low weight, making it ideal for use in portable devices and applications.

Conclusion

The ATS-11G-50-C1-R0 is an effective thermal management solution designed for low profile electronics. It utilizes combination of convection and condensation to efficiently dissipate heat from the device and has a slim profile design, allowing it to be used in tight spaces or portable applications. The device features a copper base plate and aluminum fins that are designed for high operating temperatures up to 140 degrees Celsius. The ATS-11G-50-C1-R0 is an ideal solution for cooling electronic devices in a variety of applications.

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