| Allicdata Part #: | ATS-11G-57-C3-R0-ND |
| Manufacturer Part#: |
ATS-11G-57-C3-R0 |
| Price: | $ 3.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-57-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.43539 |
| 30 +: | $ 3.24450 |
| 50 +: | $ 3.05361 |
| 100 +: | $ 2.86278 |
| 250 +: | $ 2.67193 |
| 500 +: | $ 2.48108 |
| 1000 +: | $ 2.43337 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11G-57-C3-R0 is a heat sink designed to provide thermal transfer from a heated device to the environment. This device is a typical thermal heat sink and is generally designed to help with air flow, as well as manage the dissipated heat of electronic, mechanical, and other various applications. This device is relatively common and has been used in various applications by different companies, universities, and laboratories.
The ATS-11G-57-C3-R0 is composed of anodized fins that have a uniform height and width. The fins are designed to draw heat away from the heated object and then transport the heat away from the object using air flow. This heat sink is typically used in electronic components and applications where the temperature needs to remain consistent. As air passes through the fins, it will naturally carry away the heat and provide cooling to the environment or system.
The ATS-11G-57-C3-R0 is designed to provide air flow along with efficient thermal transfer. The fins are designed with a certain spacing to create a powerful air flow. This spacing also increases the surface area of the fins, allowing for more efficient heat transfer. The fins also have a large surface area which is important for absorbing and redirecting the heat away from the heated object.
The ATS-11G-57-C3-R0 is designed for a wide variety of applications in commercial and industrial industries. This device is designed to be used in devices such as laptops, servers, and other electronic components. Additionally, this device is also used to dissipate heat in some medical and military applications.
The ATS-11G-57-C3-R0 is designed to provide an efficient heat transfer solution for many applications. This device is used for managing the heat of various components, as well as providing airflow to maintain a low temperature. The fins inside the device are designed with uniform height and width, and air flow is maximized to provide efficient heat transfer. With its wide range of applications, the ATS-11G-57-C3-R0 is a reliable thermal heat sink for many different industries.
The specific data is subject to PDF, and the above content is for reference