| Allicdata Part #: | ATS-11G-59-C3-R0-ND |
| Manufacturer Part#: |
ATS-11G-59-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-59-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is the way in which heat is transferred and dissipated from a device. Heat sinks are devices used in thermal management to help transfer heat away from devices and dissipate it into the surrounding environment. The ATS-11G-59-C3-R0 heat sink is a device designed to reduce the temperature of a device or component by dissipating its heat and allowing it to cool.
The ATS-11G-59-C3-R0 is a high-power heat sink, featuring excellent thermal performance and low noise characteristics. It is a self-adhesive single-piece heat sink with two air-cooled fins. The air-cooled fin design ensures maximum heat dissipation, while the self-adhesive application makes mounting and installation easier. The ATS-11G-59-C3-R0 also features standard mounting holes for easy mounting to any mounting surface and an optimized fin density for improved thermal performance.
The ATS-11G-59-C3-R0 is designed for applications in a variety of industries, including telecommunications, medical, consumer electronics, industrial control, automotive, and LED lighting. It is ideal for high-volume, high-power applications, and is suitable for applications requiring high cooling efficiency and low power consumption. The ATS-11G-59-C3-R0 can be used in a variety of applications, including power supplies, computers, servers, automotive electronics, and other electronic equipment.
The working principle of the ATS-11G-59-C3-R0 is based on the principles of thermoelectric cooling, or Peltier technology. This technology uses electric energy to transfer heat from one side of a thermal junction to the other. In the case of the ATS-11G-59-C3-R0, a power supply is used to provide the necessary electric energy, which is then used to transfer heat away from the device or component. The ATS-11G-59-C3-R0 also features a heat pipe to help improve the efficiency of heat transfer.
The ATS-11G-59-C3-R0 is an advanced heat sink designed to provide superior thermal management. It utilizes advanced design features, such as the air-cooled fin design and optimized fin density, to help improve thermal performance and reduce overall power consumption. Additionally, the self-adhesive application makes installation and mounting easier, and the standard mounting holes allow it to be mounted to any surface. The ATS-11G-59-C3-R0 is designed for a variety of applications, making it an ideal choice for high-volume, high-power applications.
The specific data is subject to PDF, and the above content is for reference