| Allicdata Part #: | ATS-11G-66-C1-R0-ND |
| Manufacturer Part#: |
ATS-11G-66-C1-R0 |
| Price: | $ 4.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-66-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.79386 |
| 30 +: | $ 3.58323 |
| 50 +: | $ 3.37239 |
| 100 +: | $ 3.16159 |
| 250 +: | $ 2.95082 |
| 500 +: | $ 2.74005 |
| 1000 +: | $ 2.68736 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.75°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an indispensible component of any equipment or system, particularly those that are higher wattage, and as such, requires efficient and reliable heat sinks. The ATS-11G-66-C1-R0 is a quality thermal product that helps heat-sensitive electronic components operate at lower temperatures, thereby increasing their performance and life while ensuring safer operation. This article will explain the specific applications and working principle of the ATS-11G-66-C1-R0, along with its potential benefits.
The ATS-11G-66-C1-R0 is designed to be used in any high-wattage electronic device, including those found in Data Centers, Telecommunications Centers, Medical Equipment, Power Supplies, or Automotive Systems. Its design consists of a base plate made from aluminum that houses a set of high-performance copper condensing fins. The condensing fins are designed to capture heat from devices and disperse it into the environment. This design allows the ATS-11G-66-C1-R0 to transfer the heat quickly and efficiently, ensuring that the device\'s delicate components remain at optimal operating temperatures.
The working principle behind the ATS-11G-66-C1-R0 is relatively straightforward. Heat from the device is absorbed through the base plate and is then captured and dispersed by the fins. The fins are shaped in such a way that air is kept away from the device, creating an impressive amount of surface area for heat to be transferred into the surrounding environment. This design dramatically increases the rate at which heat can be removed from the device without drastically increasing its temperature.
The ATS-11G-66-C1-R0 is designed for reliability and long-term performance. It is constructed with a lightweight yet durable aluminum frame that is corrosion-resistant and designed to withstand high temperatures. The fins are made from copper and are precision-machined for maximum efficiency. In addition, the heat sink is designed to be easily mounted and dismounted, making it a great choice for maintenance or field technicians.
The use of the ATS-11G-66-C1-R0 can benefit any device or system in need of efficient and reliable heat management. By capturing and dissipating heat at an impressive rate, the ATS-11G-66-C1-R0 ensures that all components remain at their optimal temperatures and are able to remain in service for longer periods of time. With its lightweight construction, corrosion-resistant frame, and impressive performance, the ATS-11G-66-C1-R0 is an excellent choice for any thermal management solution.
The specific data is subject to PDF, and the above content is for reference