ATS-11G-70-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-11G-70-C3-R0-ND

Manufacturer Part#:

ATS-11G-70-C3-R0

Price: $ 4.69
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11G-70-C3-R0 datasheetATS-11G-70-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.22163
30 +: $ 3.98727
50 +: $ 3.75278
100 +: $ 3.51823
250 +: $ 3.28369
500 +: $ 3.04914
1000 +: $ 2.99050
Stock 1000Can Ship Immediately
$ 4.69
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.79°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are critical components in the design and implementation of electronic devices. The ATS-11G-70-C3-R0 is a thermal management solution that is specifically designed for thermoelectric applications. This heat sink offers several benefits in terms of thermal performance and reliability.The ATS-11G-70-C3-R0 is a wide fin heat sink that utilizes seven layers of aluminum fins for maximum heat dissipation. The aluminum fins provide a large surface area for heat to dissipates and the design ensures that maximum performance is maintained even in high-temperature environments. The fins are designed with a wide pitch and optimized air flow to ensure the best possible heat transfer.The ATS-11G-70-C3-R0 has a standardized size that makes it perfectly suited for thermoelectric applications. It can be easily mounted on most standard thermoelectric components with no additional modification or adjustment required. The design also allows for easy installation, allowing for quick and efficient setup and removal.The ATS-11G-70-C3-R0 also has a long life cycle, ensuring that it will last for many years even in extremely demanding thermal environments. The fins are designed to resist deformation even at high temperatures, and the entire assembly is engineered to last through thousands of hours of use. Additionally, the construction materials and coatings provide excellent anti-corrosive properties that increase the overall lifespan of the product.The application field for the ATS-11G-70-C3-R0 includes thermoelectric cooling and heating systems. In addition, the product is ideal for LED lighting systems, medical applications, power supplies, and computer systems. Its thermal management capabilities make it an excellent choice for any electronic thermal applications that require improved cooling.The working principle of the ATS-11G-70-C3-R0 is simple. The heat sink works by transferring heat from a thermoelectric component to the atmosphere by conduction. The fins absorb the heat from the component and disperse it into the surrounding air. This efficient heat transfer allows for improved thermal performance, especially in applications that require rapid cooling or heating.The ATS-11G-70-C3-R0 is a great choice for any thermoelectric application that requires high efficiency cooling or heating. Its robust construction materials and design ensure long life even in extreme thermal environments, and its wide fin design ensures maximum heat transfer capabilities. With its ease of installation and specialized design, the ATS-11G-70-C3-R0 is an ideal choice for any thermal management system.

The specific data is subject to PDF, and the above content is for reference

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