ATS-11G-72-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.09°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction
Thermal - Heat Sinks are essential components of many electronic devices including computers, laptops, cellular phones, and other mobile devices. They are designed to dissipate heat away from the hardware and keep them cool. ATS-11G-72-C1-R0 is one such type of thermal product that has been used in a wide range of applications. In this article, we will discuss the application field and working principle of the ATS-11G-72-C1-R0.
Application Field
The ATS-11G-72-C1-R0 is primarily used in high-end development boards and computer circuitry. It is a single-sided cooling solution that is suitable for devices operating at up to 1.8GHz and below. This makes it an ideal choice for devices that need to be cooled quickly and efficiently. It is also suitable for mobile devices with limited space, as the ATS-11G-72-C1-R0 is small, lightweight, and easy to mount. It has also been used in medical applications such as MRI machines, where heat generated by the equipment must be dissipated quickly and reliably.
Working Principle
To understand the working principle of the ATS-11G-72-C1-R0 we must first look at how a typical heat sink works. Heat sinks are designed to dissipate heat away from a component or device. They work by transferring thermal energy away from the device to a cooler surface, such as a nearby wall or the air around it. The thermal energy is then dissipated away from the device and into the surrounding environment. The ATS-11G-72-C1-R0 works by using an array of aluminum fins that act as a radiator. These fins are designed to quickly and efficiently transfer thermal energy away from the device and into the surrounding atmosphere. The aluminum fins act as a heat sink, absorbing the heat generated by the device and then dissipating it away. The fins are connected to a copper heat pipe, which further dissipates the heat. Unlike a regular heat sink, the ATS-11G-72-C1-R0 has a fan that helps to ensure that the heat is dissipated away from the device quickly and evenly. The fan is also designed to reduce the overall noise output of the device, as it helps to move the hot air away from the device.
Conclusion
The ATS-11G-72-C1-R0 is a versatile thermal solution that has been used in a variety of applications. It is an ideal choice for high-end development boards and computer circuitry, as well as medical equipment such as MRI machines. By using an array of aluminum fins and a copper heat pipe, the ATS-11G-72-C1-R0 is able to quickly and efficiently dissipate heat away from the device and into the surrounding environment. The included fan ensures that the heat is dissipated away from the device quickly and evenly, while also helping to reduce the overall noise output of the device.

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