ATS-11G-73-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-11G-73-C1-R0-ND

Manufacturer Part#:

ATS-11G-73-C1-R0

Price: $ 3.13
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X10MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11G-73-C1-R0 datasheetATS-11G-73-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.81736
30 +: $ 2.74134
50 +: $ 2.58905
100 +: $ 2.43671
250 +: $ 2.28446
500 +: $ 2.20830
1000 +: $ 1.97985
Stock 1000Can Ship Immediately
$ 3.13
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 28.78°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-11G-73-C1-R0 is a thermal-heat sink product distributed by Avia Technologies Inc. This heat sink is designed to enable a system to store heat, reduce thermal levels, and maintain a consistently uniform temperature. It is an important component in some applications, providing an efficient and safe thermal solution.

This product is designed for use in telecommunications, defense, aerospace, radiation, nuclear power plants, robotics, and similar sensitive industries. With its stable and reliable thermal performance, it can be used in extreme conditions. It has a semi-passive, closed-loop design that provides reliable operation and eliminates the chances of system instability.

The ATS-11G-73-C1-R0 has an excellent thermal output. It has a high thermal conductivity, which allows for efficient heat transfer from the device to the environment. Its design is also able to manage multiple thermal points within the same application. This rule of thumb helps reduce system complexity and component count, resulting in increased system efficiency and cost savings.

The production of this heat sink involves multiple steps. It is made from Extruded aluminum for efficient thermal transfer. The aluminum is first run through an extruder to form the basic product shape. The aluminum is then moved to a finishing station where it is polished and anodized to provide the highest-quality finish.

The product is then subjected to a series of inspections and final checks before being passed to the next station for assembly. The heat sink is then attached to the operating system with mounting brackets before the associated components are tested. Once all tests are complete, the heat sink is ready for shipping.

The ATS-11G-73-C1-R0 heat sink from Avia Technologies Inc. is an efficient thermal solution for a variety of applications. Its stable and reliable design makes it well-suited for extreme conditions, providing a long-term solution that is cost-effective in the long run. The product is built with superior quality materials, ensuring highly efficient thermal transfer to the environment. In conclusion, this thermal-heat sink is an ideal choice for high-performance applications where thermal management and reliability are important cost and efficiency drivers.

The specific data is subject to PDF, and the above content is for reference

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