ATS-11G-80-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	19.22°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-11G-80-C3-R0 is a thermal heat sink designed to provide excellent thermal management for various applications. This heat sink helps to provide more efficient cooling of various components, which is essential to increase the performance and reliability of the system. The thermal heat sink is made up of a plate, which has a number of fins that extend outwards. The fins act as a heat spreader, allowing heat to be dissipated evenly and quickly.The ATS-11G-80-C3-R0 thermal heat sink can be used in a variety of applications such as power supplies, computer chips, and high-power LEDs. In power supplies, the heat sink helps to dissipate heat away from the components and away from the system. In computer chips, the heat sink can help reduce heat buildup and increase the life of the chips. With high-power LEDs, the thermal heat sink serves to reduce heat build-up and ensure maximum light output.The ATS-11G-80-C3-R0 thermal heat sink works by allowing air to flow across its surface to provide additional cooling for the components. The heat sink’s fins act as a heat spreader which draws air across the fins while creating a layer of turbulence which further enhances its cooling ability. In addition, the heat sink has a special heat pipe or Vapor Chamber which is made up of a metal tube with a large flat area for additional cooling. The heat pipe allows heat to travel through the air quickly and efficiently, and then transfer it into the fins of the heat sink.In order to maximize the cooling capabilities of the ATS-11G-80-C3-R0 thermal heat sink, it is important to ensure proper placement and orientation of the heat pipe and fins. This will ensure the most efficient air flow and ventilation. In addition, the placement of the heat pipe and fins should be away from any obstacles, so air is able to flow unrestricted.The combination of the heat pipe and fins helps to create a very efficient cooling system that can be used in a variety of applications. This makes the ATS-11G-80-C3-R0 thermal heat sink an ideal solution for many different applications. It is important to note that due to its high level of thermal management, this heat sink may require more power than other solutions. It is important to note that when selecting a heat sink for a particular application, it is important to ensure that the power requirements are considered.The ATS-11G-80-C3-R0 thermal heat sink is an excellent choice for applications requiring increased thermal management and improved cooling capabilities. The combination of the heat pipe and fins provides an efficient cooling solution that can help increase system performance and reliability. It is important to ensure that the heat pipe and fins are properly placed and oriented in order to ensure maximum efficiency. It is also important to be aware of the power requirements of this heat sink when selecting it for a particular application.

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