ATS-11G-82-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-11G-82-C3-R0-ND

Manufacturer Part#:

ATS-11G-82-C3-R0

Price: $ 3.72
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X25MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11G-82-C3-R0 datasheetATS-11G-82-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.37617
30 +: $ 3.28503
50 +: $ 3.10250
100 +: $ 2.91999
250 +: $ 2.73748
500 +: $ 2.64622
1000 +: $ 2.37248
Stock 1000Can Ship Immediately
$ 3.72
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.97°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are crucial when it comes to keeping electronics from over-heating. Heat sinks provide efficient heat dispersion, allowing for a steady transfer of energy while providing a cooling effect. The ATS-11G-82-C3-R0 is a high-performance, thermally efficient heat sink designed to distribute heat in high performance applications.

The ATS-11G-82-C3-R0 is designed to be used in a variety of applications where high thermal performance is essential. The unique design of this heat sink makes it suitable for use in servers, gaming systems, home electronics, and other applications that require efficient thermal dissipation. The design also improves efficiency in applications that are prone to high temperatures, such as in automobiles or laptops.

The ATS-11G-82-C3-R0 features an innovative two-stage cooling system that efficiently dissipates heat through a combination of convection and conduction cooling. The combination of these two techniques makes this heat sink an ideal choice for applications where consistent and reliable cooling is essential. Thanks to its unique design, the ATS-11G-82-C3-R0 is able to dissipate heat up to 375 watts.

The ATS-11G-82-C3-R0 features a unique fin design that promotes improved thermal performance. The fins are divided into two separate sets, with each set having a unique structure. The top set of fins is designed to encourage airflow and dissipate heat through convection cooling. Meanwhile, the bottom set features solid fins that are designed to aid in effective conduction cooling. By combining both sets of fins, the overall cooling performance of the heat sink is improved. Additionally, the fins are designed to be spaced in such a way that they allow air to pass freely through the heat sink. This helps reduce noise levels and improves efficiency.

The ATS-11G-82-C3-R0 also features an optimized mounting system that helps ensure consistent thermal performance. The mounting system helps to dampen vibrations and eliminate any potential noise associated with the installation. In addition to the mounting system, the ATS-11G-82-C3-R0 features a unique fan system that allows for more efficient airflow. This helps to reduce the temperature in the surrounding environment and ensure effective cooling.

Overall, the ATS-11G-82-C3-R0 is an effective and reliable thermal solution for a wide range of applications. Its innovative two-stage cooling system, efficient fin design, and optimized mounting system make it perfect for preventing overheating in diverse environments. Thanks to its efficient cooling properties, the ATS-11G-82-C3-R0 is the perfect choice for keeping electronics running at an optimal temperature.

The specific data is subject to PDF, and the above content is for reference

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