| Allicdata Part #: | ATS-11G-97-C1-R0-ND |
| Manufacturer Part#: |
ATS-11G-97-C1-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11G-97-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management has become an increasingly important factor in the safe operation of today\'s high-powered electronics. Proper thermal management helps to prevent component failure, as well as maximize component reliability. Heat sinks are a great way to help dissipate heat from electronic components, ensuring that the components remain within the specified operating temperature range. The ATS-11G-97-C1-R0 is a passive heat sink designed for use with high-powered electronics. The following article will discuss the application field and working principle of the ATS-11G-97-C1-R0.
The ATS-11G-97-C1-R0 is a two-way heat sink optimized for natural convection and air-side cooling. It is specifically designed to dissipate heat from high-powered electronic components, such as CPUs, GPUs, and memory modules. The ATS-11G-97-C1-R0 produces an effective cooling performance even in confined environments, making it ideal for use in small form factor systems. The ATS-11G-97-C1-R0 is also resistant to corrosion and thermally conductive material, making it suitable for use in a wide variety of industries.
The ATS-11G-97-C1-R0 features a symmetrical design with extended corner fins that provide increased surface area for improved thermal performance. In addition, the ATS-11G-97-C1-R0 has an aluminum construction with a black anodized finishing for superior heat dissipation. The heat sink also features built-in fins that reduce air velocity and turbulence for improved cooling efficiency.
The ATS-11G-97-C1-R0 works by transferring heat from the electronic components to the ambient air via convection. The heat is dissipated from the aluminum base and fins by natural air convection. The ATS-11G-97-C1-R0 is able to dissipate heat more efficiently than other traditional heat sinks due to its optimized design and large surface area. The heat sink also features a fanless design, eliminating potential noise and vibration from the system.
In conclusion, the ATS-11G-97-C1-R0 is a passive heat sink designed for use with high-powered electronics. It is optimized for natural convection and air-side cooling of confined spaces. The ATS-11G-97-C1-R0 features a symmetrical design with extended corner fins for improved thermal performance and is made of aluminum for superior heat dissipation. The heat sink also features built-in fins to reduce air velocity and turbulence for improved performance. The ATS-11G-97-C1-R0 works by transferring heat from the electronic components to the ambient air via convection, ensuring that the components remain within the specified operational temperature range.
The specific data is subject to PDF, and the above content is for reference