| Allicdata Part #: | ATS-11H-100-C3-R0-ND |
| Manufacturer Part#: |
ATS-11H-100-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-11H-100-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks: ATS-11H-100-C3-R0 application field and working principle
Thermal heat sinks are devices used to transfer and dissipate excess heat from components in an electrical system. In order to ensure the efficient functioning of the system, these devices are used to regulate the temperatures of individual components and to help to prevent them from overheating. They are especially important in computer systems, as the temperatures in electrical-electronic systems can cause permanent damage to components, leading to failure and increased energy costs. The ATS-11H-100-C3-R0 heat sink is designed for use in thermal interface applications in electronics for controlling the temperatures of electrical components, and is a popular choice of many engineers and designers.
The ATS-11H-100-C3-R0 heat sink is constructed from high-performance extruded aluminum. This composition allows for high heat dissipation and superior thermal performance. This type of heat sink also has a higher thermal-to-weight ratio than traditional heat sinks, making it an economical choice for the application. The heat sink also features a thermally optimized cooling package which helps it to provide superior thermal stability. Furthermore, the heat sink is designed with a finned design that provides improved airflow and cooling efficiency.
The ATS-11H-100-C3-R0 is designed for use in a number of electronic thermal interface applications. These applications include LED lighting, power supplies, automotive electronics, and industrial embedded computing systems. The heat sink is widely used in the electronics industry for controlling the temperatures of various electronic components in order to ensure better performance and reliability. In addition, the heat sink is also suitable for use in medical applications, as it offers superior thermal management for medical electronics.
The ATS-11H-100-C3-R0 is designed for use in thermal interfaces, or as a cooling component to regulate the temperature of components in the electrical system. The heat sink works on the principle of thermal management. This is the process by which heat is dissipated or saved from a system. This process involves controlling the temperature of the components, which helps to prevent damage to the components and help extend their life span.
The ATS-11H-100-C3-R0 heat sink is an effective choice for controlling temperature in the electrical system. Its high performance aluminum construction, finned design, and thermally optimized cooling package help to ensure superior thermal management. This type of heat sink is a popular choice among engineers and designers due to its superior thermal performance and low cost. This ensures that the ATS-11H-100-C3-R0 is an ideal choice for many thermal interface applications.
The specific data is subject to PDF, and the above content is for reference
ATS-11H-100-C3-R0 Datasheet/PDF