ATS-11H-107-C2-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.969" (50.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.374" (9.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	27.93°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-11H-107-C2-R1 application field and working principleThermal-heat sinks are components that employ the use of a reactive heat-sensitive material to dissipate heat away from its source. The ATS-11H-107-C2-R1 is a conduction-based heat sink specifically designed to work with single-point liquid cooling systems. This heat sink is fabricated with aluminum, and its top and bottom surfaces have been electroplated with copper, allowing for a higher thermal transfer rate than is usually found with conventional aluminum heat sinks.The ATS-11H-107-C2-R1 has multiple features specific to its design for proper heat dissipation. The top surface of the heat sink is characterized by thin copper fins of various sizes arranged in a precise pattern in order to maximize the area available for air-cooling. On the bottom surface of the heat sink, a single-point liquid cooling system is integrated, allowing for direct flow of liquid cooling medium to the base of the heat sink. This effective liquid cooling system allows for a rapid transfer of heat away from the unit, resulting in a longer lifespan than with traditional aluminum heat sinks.The ATS-11H-107-C2-R1 will help maintain optimal temperatures in a variety of applications. Whether it is used in video game consoles, industrial machines, computers, or other electronic devices, the ATS-11H-107-C2-R1 will help prevent overheating and improve the longevity of the components. Moreover, its lightweight and highly resilient design will ensure a long-lasting and reliable performance in most settings.In terms of working principle, this conduction-based heat sink works by liquid flowing from the bottom surface of the unit into the center of its interior space. The heat is then conducted away from the processor and into the surrounding liquid which is quickly circulated away from the heat sink and into another heat exchange device where the heat can be dissipated or dissipated to the atmosphere. This process reduces the temperature of the processor, extending the life cycle of the device significantly.In conclusion, the ATS-11H-107-C2-R1 is an exemplary thermal-heat sink designed to efficiently handle the heat generated by processors or other electronic components. Its design allows for rapid heat dissipation, improved reliability and long-lasting performance. Further, its single point liquid cooling and robust aluminum construction make it an excellent choice for any application requiring optimal thermal management solutions.

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