ATS-11H-110-C3-R1 Allicdata Electronics
Allicdata Part #:

ATS-11H-110-C3-R1-ND

Manufacturer Part#:

ATS-11H-110-C3-R1

Price: $ 5.26
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X40X12.7MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11H-110-C3-R1 datasheetATS-11H-110-C3-R1 Datasheet/PDF
Quantity: 1000
10 +: $ 4.73067
30 +: $ 4.46796
50 +: $ 4.20512
100 +: $ 3.94235
250 +: $ 3.67953
500 +: $ 3.41671
1000 +: $ 3.35100
Stock 1000Can Ship Immediately
$ 5.26
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.126" (54.01mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 27.08°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal-Heat Sinks are components that absorb and dissipate heat from electronic and mechanical devices. They play an important role in controlling the operating environment of a device by providing an efficient means of removing heat. The ATS-11H-110-C3-R1 is a Thermal-Heat Sink that is used in a number of applications. This article will discuss the application field and working principle of this device.

Applications

The ATS-11H-110-C3-R1 can be found in a variety of applications. It is commonly used in consumer electronics such as cell phones, laptops, and other portable devices. It is also used in industrial machinery, such as 3D printers, to reduce thermal stress on the components. The unit can also be used in household appliances such as air conditioners and refrigerators to improve the efficiency of the device. Additionally, the ATS-11H-110-C3-R1 is used in research and development labs for cooling down experiment components to precise temperatures.

Working Principle

The ATS-11H-110-C3-R1 is designed to absorb and dissipate heat efficiently. It works by using heat sinks to absorb heat from the components and then dissipate it through a series of finned aluminum panels. The fins on the panels increase the surface area, allowing more heat to be absorbed from the device and dissipated into the surrounding environment. The unit also contains a fan to help reduce the temperature of the air inside the device and increase the efficiency of the cooling system.

The ATS-11H-110-C3-R1 also utilizes a heat pipe to quickly transfer heat from the device to the heat sink. Heat pipes are hollow metal devices that use a wicking material to move heat along the pipe. This allows the heat to quickly move through the pipe and dissipate to the heat sink and surrounding environment. This helps to increase the efficiency of the system and reduce the overall temperature.

In addition to the above, the ATS-11H-110-C3-R1 also includes a thermal switch. This switch is used to activate the cooling system when the temperature of the device reaches a predetermined level. The switch then triggers the fan to increase air flow over the heat sinks and allow for more efficient cooling.

The ATS-11H-110-C3-R1 is a versatile Thermal-Heat Sink that can be used in a range of applications. Its efficient design and components allow for effective heat transfer and dissipate while keeping the device at its optimal temperature.

The specific data is subject to PDF, and the above content is for reference

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