
Allicdata Part #: | ATS-11H-110-C3-R1-ND |
Manufacturer Part#: |
ATS-11H-110-C3-R1 |
Price: | $ 5.26 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X40X12.7MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 4.73067 |
30 +: | $ 4.46796 |
50 +: | $ 4.20512 |
100 +: | $ 3.94235 |
250 +: | $ 3.67953 |
500 +: | $ 3.41671 |
1000 +: | $ 3.35100 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Rectangular, Fins |
Length: | 2.126" (54.01mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 27.08°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are components that absorb and dissipate heat from electronic and mechanical devices. They play an important role in controlling the operating environment of a device by providing an efficient means of removing heat. The ATS-11H-110-C3-R1 is a Thermal-Heat Sink that is used in a number of applications. This article will discuss the application field and working principle of this device.
Applications
The ATS-11H-110-C3-R1 can be found in a variety of applications. It is commonly used in consumer electronics such as cell phones, laptops, and other portable devices. It is also used in industrial machinery, such as 3D printers, to reduce thermal stress on the components. The unit can also be used in household appliances such as air conditioners and refrigerators to improve the efficiency of the device. Additionally, the ATS-11H-110-C3-R1 is used in research and development labs for cooling down experiment components to precise temperatures.
Working Principle
The ATS-11H-110-C3-R1 is designed to absorb and dissipate heat efficiently. It works by using heat sinks to absorb heat from the components and then dissipate it through a series of finned aluminum panels. The fins on the panels increase the surface area, allowing more heat to be absorbed from the device and dissipated into the surrounding environment. The unit also contains a fan to help reduce the temperature of the air inside the device and increase the efficiency of the cooling system.
The ATS-11H-110-C3-R1 also utilizes a heat pipe to quickly transfer heat from the device to the heat sink. Heat pipes are hollow metal devices that use a wicking material to move heat along the pipe. This allows the heat to quickly move through the pipe and dissipate to the heat sink and surrounding environment. This helps to increase the efficiency of the system and reduce the overall temperature.
In addition to the above, the ATS-11H-110-C3-R1 also includes a thermal switch. This switch is used to activate the cooling system when the temperature of the device reaches a predetermined level. The switch then triggers the fan to increase air flow over the heat sinks and allow for more efficient cooling.
The ATS-11H-110-C3-R1 is a versatile Thermal-Heat Sink that can be used in a range of applications. Its efficient design and components allow for effective heat transfer and dissipate while keeping the device at its optimal temperature.
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