| Allicdata Part #: | ATS-11H-114-C3-R0-ND |
| Manufacturer Part#: |
ATS-11H-114-C3-R0 |
| Price: | $ 3.47 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11H-114-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.15063 |
| 30 +: | $ 3.06516 |
| 50 +: | $ 2.89498 |
| 100 +: | $ 2.72462 |
| 250 +: | $ 2.55435 |
| 500 +: | $ 2.46919 |
| 1000 +: | $ 2.21376 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.53°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management electronics offer high performance solutions that help dissipate heat away from components. The ATS 11H-114-C3-R0 Heat Sink is a simple solution designed to meet the needs of small appliances, portable electronics, and advanced medical devices. It is composed of aluminum for optimal heat dissipation, and requires minimal space thanks to its thin profile.
This thermal solution can help protect and extend the life of components by reducing the temperature away from the sink surface. It is designed to cool high power semiconductor devices, and can help the component operate optimally and safely in hot conditions. The aluminum sink helps spread heat away from the surface of the component, allowing it to remain cooler by up to 50-60°C.
This aluminum heat sink uses air convection to dissipate thermal energy away from the component. This is accomplished by allowing hot air to rise away from the component, while cool air is brought in to take its place. By using such a simple setup, the kit can be effective in environments with low air circulation.
This thermal solution comes with an adjustable mounting bracket that works on a wide range of components. The bracket can be adjusted to fit flat-pack and dual-in-line packages, as well as DIP and PGA packages. It also has a mounting surface that helps secure the component in place. The bracket also eliminates the need for additional components, as it can hold the component securely against the heat sink.
The ATS 11H-114-C3-R0 Heat Sink is designed for applications in a variety of industries, including power supplies, lighting systems, semiconductor devices, medical devices, lasers, and more. This thermal solution offers a simple and effective way to reduce temperature and extend component life. It is an ideal solution for any application requiring superior thermal management solutions.
The specific data is subject to PDF, and the above content is for reference