| Allicdata Part #: | ATS-11H-126-C1-R0-ND |
| Manufacturer Part#: |
ATS-11H-126-C1-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11H-126-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are important components of electronic systems, which are used to absorb and dissipate heat generated in the operation of electronic devices. The ATS-11H-126-C1-R0 is a type of thermal heat sink with a variety of applications.
Application field
The ATS-11H-126-C1-R0 heat sink is mainly used in the electronic systems of digital products and industrial control systems, such as computers, audio and video equipment, robotics equipment, automotive products, server systems and other high-end products. The heat dissipation capacity and reliability of the product are suitable for most occasions.
Working principle
The working principle of the ATS-11H-126-C1-R0 heat sink is based on the transfer of heat. The heat generated by the electronic device is conducted to the heat sink surface, then dissipated into the space, the air or the surrounding environment through thermal radiation and convection. The heat flux is conducted to the outside of the device though the cooling fin, improving the performance of the device.
Other features
The ATS-11H-126-C1-R0 heat sink is designed with a combination of advanced design concepts and efficient heat dissipation principles, which enables it to obtain a good heat transfer performance. It is lightweight and compact, making it easy to install and use. Moreover, the fin structure increases the surface area of the heat radiation, which makes it suitable for high power devices.
Conclusion
In conclusion, the ATS-11H-126-C1-R0 heat sink is well suited to deal with the heat generated by high power electronic devices. It features advanced design concepts and efficient heat dissipation principles which provide reliable and safe thermal performance. As a result, it has a wide range of applications in a variety of fields.
The specific data is subject to PDF, and the above content is for reference