| Allicdata Part #: | ATS19920-ND |
| Manufacturer Part#: |
ATS-11H-14-C2-R0 |
| Price: | $ 4.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11H-14-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.95640 |
| 10 +: | $ 3.85182 |
| 25 +: | $ 3.63787 |
| 50 +: | $ 3.42380 |
| 100 +: | $ 3.20979 |
| 250 +: | $ 2.99580 |
| 500 +: | $ 2.78181 |
| 1000 +: | $ 2.72832 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential nowadays for a variety of industries, from telecommunications to computers, medical devices, and aircraft. A thermal management solution not only provides efficient cooling but also regulates temperature and maintains operational stability. Heat sinks are one of the most important thermal management components, and the ATS-11H-14-C2-R0 is a high-performance heat sink designed for consumer electronics and other applications.
The ATS-11H-14-C2-R0 is a pin fin aluminum heat sink with the same dimensions as its predecessor, the AT-11C-14-C1-R6. Its aluminum chassis has an anodized surface and a flat profile that is ideal for cooling consumer electronics such as computers, smartphones, and tablets. The heat sink has a cover made of highly durable ABS plastic and a fin pitch of 10 mm. This allows for greater convection and contribute to the heat sink’s unmatched performance.
The ATS-11H-14-C2-R0 is designed for applications where maximum performance and maximum heat dissipation is required. It has a specified maximum air heat load of 20 W, making it the ideal choice for high-powered components such as processors, GPUs, and other VCs. The device is also designed for applications where low temperatures are a must, such as in medical systems where precise temperatures must be maintained to ensure the accuracy of medical devices.
The ATS-11H-14-C2-R0 is a self-contained heat sink and is therefore compatible with any standard air fan. It features an innovative cooling technology that employs air gap technology and patented fin design, which allow for more efficient heat transfer into the surrounding environment. The combination of these two technologies makes the ATS-11H-14-C2-R0 stand-out in terms of performance and reliability.
The air gap technology works by creating a gap between the heat sink’s aluminum body and the fan itself. This gap allows for increased airflow, resulting in improved thermal management. The patented fin design also improves thermal efficiency as it increases surface area, allowing for better heat dissipation and improved cooling performance. This makes the ATS-11H-14-C2-R0 a great choice for applications where high performance and maximum heat dissipation are key goals.
In addition to its excellent performance and reliability, the ATS-11H-14-C2-R0 also offers a variety of installation options. It can be mounted on boards with the included mounting holes and fits standard mounting brackets. The device is also designed for applications with tight environmental conditions, such as high vibration, which makes it ideal for use in aerospace and industrial applications. This makes the ATS-11H-14-C2-R0 a perfect choice for various applications.
To sum up, the ATS-11H-14-C2-R0 is a top-of-the-line heat sink designed for use in a variety of high-performance applications. It has a specified maximum air heat load of 20 W, making it the ideal choice for high-powered components such as processors and GPUs. The device features an innovative air gap technology and patented fin design, which allow for more efficient heat transfer and improved thermal management. The ATS-11H-14-C2-R0 is also designed for applications with tight environmental conditions, such as high vibration, making it the perfect choice for various thermal management solutions.
The specific data is subject to PDF, and the above content is for reference