| Allicdata Part #: | ATS-11H-140-C1-R0-ND |
| Manufacturer Part#: |
ATS-11H-140-C1-R0 |
| Price: | $ 3.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11H-140-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.87721 |
| 30 +: | $ 2.79909 |
| 50 +: | $ 2.64361 |
| 100 +: | $ 2.48812 |
| 250 +: | $ 2.33264 |
| 500 +: | $ 2.25488 |
| 1000 +: | $ 2.02162 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-11H-140-C1-R0 is a type of aluminum thermal-heat sink. It is designed to dissipate heat from electronic components in various types of electronic devices. The thermal-heat sink, when correctly installed, is capable of reducing both the device\'s operating temperature and the overall temperature of the environment and thus improving performance through enhanced cooling efficiency.
The thermal-heat sink works by absorbing and dissipating heat using the natural convection of the air. A fan can also be used to further improve the cooling. When the air in the device is heated up, the ATS-11H-140-C1-R0 thermal-heat sink absorbs it and the fins spread the heat from the heat sink along with ventilation so that the air can circulate efficiently. The air then flows away from the heat sink, decreasing the overall temperature, making the device more thermally efficient.
The ATS-11H-140-C1-R0 thermal-heat sink is designed to reduce the temperature of many different types of electronics ranging from laptop computers, tablets, servers, and gaming systems to 3D printers, industrial robotics, and energy storage systems. The heat sink is designed to be used in various applications and environments including home, office, data centers, and automotive and industrial applications.
The thermal-heat sink is manufactured with high-grade aluminum alloy and then plated with a natural black finish. The aluminum alloy is designed to have excellent thermal conductivity so that the heat spreading capability of the heat sink is maximized. It also has excellent mechanical strength and wear resistance, making it capable of withstanding the rigors of vibreation and shock while still providing excellent cooling performance.
The ATS-11H-140-C1-R0 thermal-heat sink also has a unique "pin aircraft" setup. This pin aircraft arrangement offers superior thermal performance, better load compatibility, and better airflow control. The pins are designed to disperse heat away from the heat sink\'s surface for better cooling performance.
When the ATS-11H-140-C1-R0 thermal-heat sink is correctly installed and used in adherence with the manufacturer\'s directions, it can provide significant performance improvements for a variety of different types of electronic devices. The cooling capacities of the device can help it to function reliably even during high demand operations and increased temperatures. The thermal-heat sinks can also be used in many different environments where cooling is required, including home, office, data centers, and automotive and industrial applications.
The specific data is subject to PDF, and the above content is for reference