ATS-11H-160-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.65°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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When it comes to thermal management solutions, few products match the efficiency and effectiveness of the ATS-11H-160-C1-R0 heat sink. Effective thermal management is essential for keeping electronic components functioning properly and avoiding costly repair or replacement costs. The ATS-11H-160-C1-R0 is optimised for use in high-density applications with limited space. Its versatility and adequate thermal resistance makes it an ideal choice for applications ranging from consumer electronics, servers, data centres, automotive and medical industry.The ATS-11H-160-C1-R0 is a thermal management solution that uses air-cooled fins or air-cooled heat sinks to dissipate heat generated by electronics. The heat sink utilizes a finned surface design that creates a large cooling surface area to maximize cooling efficiency and performance. The design also helps to reduce the thermal gradient between the heat source and the sink. This design also maximizes the effective contact area between the fins and surrounding air, allowing the heat to be quickly dissipated.The ATS-11H-160-C1-R0 consists of a base, a set of fins and two mounting plates for easy installation. The finned surface is made of anodized aluminium and is designed to freely dissipate the heat generated by the electronics. For maximum performance, the finned surface should be oriented in such a way that air can freely pass through, allowing for maximum cooling efficiency.The main working principle behind the ATS-11H-160-C1-R0 is that when an electronic component is used, it generates heat which must be dissipated equally over the entire surface of the component for optimal performance. The ATS-11H-160-C1-R0 facilitates this by increasing the surface area of the component, thus increasing the area over which heat can be dissipated. This helps to keep the temperature of the component within safe limits and avoid any needless damage.The unique design and high performance of the ATS-11H-160-C1-R0 makes it an ideal choice for many industries. Its versatility in design makes it suitable for both low and high-density applications, and its efficient thermal management solution makes it ideal for industries such as consumer electronics, servers, data centres, automotive and medical industry. It provides an effective thermal management solution that keeps electronics safe and functioning to optimal performance.

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