| Allicdata Part #: | ATS-11H-161-C3-R0-ND |
| Manufacturer Part#: |
ATS-11H-161-C3-R0 |
| Price: | $ 4.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11H-161-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.96711 |
| 30 +: | $ 3.74703 |
| 50 +: | $ 3.52661 |
| 100 +: | $ 3.30618 |
| 250 +: | $ 3.08577 |
| 500 +: | $ 2.86535 |
| 1000 +: | $ 2.81025 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks
Thermal – Heat Sinks are an important and fundamental application in the area of electronics. They are widely used in electronics cooling, industrial cooling processes and as hardware devices to reduce temperature for the use of other electronics components. In this article, we will take a look at the application field and working principle of ATS-11H-161-C3-R0, which has become a popular choice in the thermal-heat sink world.
ATS-11H-161-C3-R0 is a copper-base finned heat sink. This heat sink heatsink comes with multi-tubes flattened copper fins which gives it a high efficiency and superior heat dissipation . The high efficiency heat dissipation properties of the ATS-11H-161-C3-R0 makes it an ideal choice for cooling applications in electronics components like CPUs, graphics processors, and other computer chips.
ATS-11H-161-C3-R0 heat sink offers superior thermal performance, low airflow resistance, and the ability to cool components in the same thermal area. The heat sink also has a large enough design that it can provide effective cooling to larger devices.
The application field and working principle of ATS-11H-161-C3-R0 as a thermal-heat sink hinge upon its copper fins. The copper fins absorb heat from the electronics component to which it is connected, and dissipates it away from the component. The copper fins also provide a path for convection cooling – transfer of heat by passing air over the fins.
The heat sink has a vertical orientation, which is ideal for pushing hot air away from the component and reducing the noise from fan. The copper fins of the heat sink are designed to draw the heat away quickly and efficiently. This, in turn, helps keep the component running at optimum temperature. In addition, the heat sink is very lightweight, but has a large surface area, making it effective in dissipating heat from the component.
The copper fins also provide high electrical conductivity, which ensures reliable performance. The ATS-11H-161-C3-R0 is also designed for superior durability, with its corrosion-resistant material and anodized finish.
The ATS-11H-161-C3-R0 is also designed to be easily installed. It can be mounted using screws, push-in clips, or adhesive tape. It can also be mounted to a motherboard or other components without the need for additional mounting hardware.
When it comes to the application field of this heat sink, it is mainly used in electronics components that need cooling such as CPUs, graphics processors, motherboards and video cards. Its superior thermal performance and low airflow resistance means that it can effectively cool these components without extra cooling fans. Since it is lightweight and has a large surface area, the ATS-11H-161-C3-R0 is also ideal for cooling mobile or embedded devices.
In conclusion, the ATS-11H-161-C3-R0 thermal-heat sink is an excellent choice for cooling applications, and it provides superior thermal performance and reliability. Its lightweight yet effective design and superior electrical conductivity make it an ideal solution for cooling devices used in electronics components. It is also easily installed, and its corrosion-resistant material and anodized finish provide superior durability.
The specific data is subject to PDF, and the above content is for reference