| Allicdata Part #: | ATS-11H-168-C3-R0-ND |
| Manufacturer Part#: |
ATS-11H-168-C3-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11H-168-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are essential components in many areas whose purpose is to absorb excessive heat generated and to dissipate the heat cold environment, in order to maintain the system working smoothly. One of the most popular solutions in this field is the ATS-11H-168-C3-R0. This device is suitable for many applications which require high quality thermal conductivity and heat dissipation capacity.
The ATS-11H-168-C3-R0 is a high performance thermal solution, designed to provide a maximum heat dissipation rate. This highly efficient heatsink features an outer aluminum frame and a copper base, where the heat generated is collected through contact with the electronic components. The heat is then dissipated to the environment through the fins which are supported by the frame. The R0 variety of the model possesses integrated cooling towers with even higher cooling efficiency.
Aside from the thermal efficiency of the ATS-11H-168-C3-R0, it is a great solution when saving space is a priority. Its slim form factor takes only about 2.5 inches of width which helps it fit in limited spaces and reduces the size of the host system. The device can be easily mounted both horizontally and vertically using standard mounting hardware.
The case of the ATS-11H-168-C3-R0 integrates conveniently with the other electronic components and uses an advanced fan-less natural convection cooling system, allowing silent operation in all environments. Its Thermal Resistance of 0.1 C/W allows high processing speed without too much heat generation. This makes it an ideal solution for many applications where reliable performance and heat dissipation are of utmost importance.
The ATS-11H-168-C3-R0 is an ideal choice for a variety of applications ranging from industrial control systems to communication and networking systems. Its silent operation, reliable cooling power, and compact form factor make this heatsink the go-to choice for many engineers. Thanks to its high-grade structure, the ATS-11H-168-C3-R0 is able to provide optimized long-lasting performance and stability even at high temperatures.
In conclusion, ATS-11H-168-C3-R0 is a perfect choice for many applications requiring efficient and reliable thermal solutions. Featuring enhanced cooling performance, a slim profile, and reliable operation, this heatsink is the leading choice for many applications.
The specific data is subject to PDF, and the above content is for reference