ATS-11H-197-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	11.05°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-11H-197-C3-R0 Application Field and Working Principle

Thermal - heat sinks are used to dissipate the heat generated by electronic components and devices. In order to meet the requirements of different applications, various types of thermal - heat sinks are available in the market. ATS-11H-197-C3-R0 is one of the commonly used types of heat sinks for extracting heat from electronic components such as processors, memory chips, power supplies, video cards, etc. This article will discuss the application field and working principle of ATS-11H-197-C3-R0, focusing on its structure, materials, applications, and performance.

Structure of ATS-11H-197-C3-R0

The structure of the ATS-11H-197-C3-R0 heat sink is composed of the following components: a base, fins, and several air channels. The base is made of metal, either aluminum or copper, and is machined into various shapes to fit into the component’s mounting socket. The fins are made of aluminum and are designed to absorb the heat generated by the electronic components and dissipate it to the surrounding air. The air channels allow for the flow of air in order to create a continuous circulation of air, which aids in the efficient dissipation of heat.

Materials of ATS-11H-197-C3-R0

The ATS-11H-197-C3-R0 heat sink is primarily made of aluminum and copper, both of which are widely used in the electronics industry for heat dissipation purposes. Aluminum is widely used in this type of heat sink due to its excellent thermal conductivity and its lightweight properties. Copper, although more expensive than aluminum, provides better resistance against corrosion and greater thermal conductivity.

Applications of ATS-11H-197-C3-R0

The ATS-11H-197-C3-R0 heat sink is designed for use in a variety of electronic components and devices, including processors, memory chips, power supplies, video cards, and others. It is often used in conjunction with a cooling fan to provide additional airflow to the component, and can also be used with a heat sink compound to improve the thermal performance of the component. In addition, the ATS-11H-197-C3-R0 can be mounted onto a chassis or other existing device for easy installation and increased air circulation.

Performance of ATS-11H-197-C3-R0

The ATS-11H-197-C3-R0 heat sink is designed with an optimal design of fins to provide maximum performance. The combination of metal and air channels allows for the efficient transfer of heat, resulting in improved component reliability. The heat sink also features an improved thermal performance due to its effective air circulation and high thermal conductivity. In addition, the ATS-11H-197-C3-R0 is designed for maximum compatibility with other devices, allowing for easy installation and efficient operation.

Conclusion

The ATS-11H-197-C3-R0 is a heat sink designed for use in a variety of electronic components and devices. The structure of the heat sink consists of a base, fins, and air channels. It is made of aluminum and copper, and is designed to allow for improved air circulation and efficient heat transfer. The ATS-11H-197-C3-R0 is known for its excellent thermal performance, high compatibility with other devices, and easy installation.

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