| Allicdata Part #: | ATS-11H-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-11H-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11H-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a specialized type of thermal management solution designed to draw heat away from an object or surface. The most common application for heat sinks is in computer and electronics devices, but they can be used in a variety of other industries as well. The ATS-11H-20-C3-R0 is a heat sink designed for high-power, high-density applications. It has a rugged aluminum alloy construction and is rated for 20 watts of dissipation
The ATS-11H-20-C3-R0 is designed to optimize heat dissipation by providing a large surface area with a unique fin pattern. This fin pattern creates channels of air flow which facilitates efficient heat transfer. The heat sink also features a built-in clip, allowing it to be mounted on a variety of surfaces. The ATS-11H-20-C3-R0 has been designed to meet the demands of high-power, high-density applications and can operate in temperatures up to 150°C.
The heat sink’s working principle is based on the law of thermodynamics. Heat is transferred from the object or surface to the heat sink through radiation, conduction, and convection. This transfer of heat occurs when the temperature of the heat sink is lower than that of the object. The heat generated by the object or surface then moves to the surface of the heat sink either by radiation or conduction. When the heat reaches the surface of the heat sink, it is then dispersed by the convection of air brought on by the unique fin pattern.
The applications of the ATS-11H-20-C3-R0 heat sink vary from its use in computer and electronics cooling systems to its use in a variety of other industries. In the electronic and computer industry, the heat sink is used to cool CPUs, memory modules, video cards, RAM, and other high-power components. In other industries, it is used in industrial machinery, medical equipment, and automotive applications.
The ATS-11H-20-C3-R0 heat sink is designed for maximum heat dissipation so that it can be used in high-power, high-density applications. Its unique fin pattern allows for efficient heat transfer while its rugged aluminum alloy construction allows for a high-temperature operation range. The ATS-11H-20-C3-R0 is suitable for use in a variety of industries, including computer and electronic cooling systems, industrial machinery, medical equipment, and automotive applications.
The specific data is subject to PDF, and the above content is for reference