ATS-11H-210-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.24°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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TABLE OF CONTENTSI. IntroductionII. Overview of ATS-11H-210-C3-R0 III. Applications of ATS-11H-210-C3-R0IV. Working PrincipleV. ConclusionI. IntroductionHeat sinks are a type of active thermal management device used to improve the cooling of electrical and electronic components. Heat sinks absorb unwanted heat, which is then dissipated through air convection. NTE Electronics offers a selection of leading thermal - heat sinks, and the ATS-11H-210-C3-R0 is one of these. This paper will provide an overview of the ATS-11H-210-C3-R0 – including its application fields and working principle. II. Overview of ATS-11H-210-C3-R0 The ATS-11H-210-C3-R0 thermal - heat sink is an aluminum finned heatsink designed for board-level heat transfer applications. This unit features an integrated spring clip and 20mm R-Clip fastening system to create a low-profile design that decreases the risk of mechanical wear, offers outstanding thermal conductivity due to its aluminum construction, and allows for accurate air-to-base thermal contact due to its natural convection feature. The ATS-11H-210-C3-R0 is available in 3 different sizes: a Compact 85x20mm size, a Mid-size 93x40mm size, and a full-size 110x60mm size. III. Applications of ATS-11H-210-C3-R0The ATS-11H-210-C3-R0 thermal - heat sink is suitable for a variety of applications, including high-power RF and amplifier modules, power supplies, and DC-DC converters. This unit is specifically designed to offer high level of thermal conductivity, low-profile mounting, and excellent air-to-base contact, making it ideal for these specific applications. Additionally, the ATS-11H-210-C3-R0 has the ability to handle high-power load requirements, making it suitable for a variety of electronics industries as well as an extensive range of consumer electronics. IV. Working PrincipleThe ATS-11H-210-C3-R0 is a passive thermal management device which uses natural convection to dissipate heat. Natural convection occurs when hot air rises due to its lighter density and subsequently colder air is drawn in to replace it. The ATS-11H-210-C3-R0 features a low-profile design which minimizes the risk of mechanical wear and ensures the unit remains firmly resistant to vibration. This design also allows for excellent air-to-base thermal contact. For improved heat transfer, the ATS-11H-210-C3-R0 unit is equipped with an aluminum finned heatsink for maximum thermal conductivity.V. Conclusion The ATS-11H-210-C3-R0 thermal - heat sink is a reliable and energy-efficient solution for board-level heat transfer applications. This unit has the ability to handle high-power load requirements, making it suitable for a variety of electronics industries as well as an extensive range of consumer electronics. Additionally, its low-profile design and aluminum finned heatsink optimize thermal performance to ensure accurate thermal contact and outstanding thermal conductivity.

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