| Allicdata Part #: | ATS-11H-24-C1-R0-ND |
| Manufacturer Part#: |
ATS-11H-24-C1-R0 |
| Price: | $ 4.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11H-24-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.08303 |
| 30 +: | $ 3.85623 |
| 50 +: | $ 3.62943 |
| 100 +: | $ 3.40257 |
| 250 +: | $ 3.17573 |
| 500 +: | $ 2.94889 |
| 1000 +: | $ 2.89218 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink is an important component in keeping cool electronics like computers and cell phones working properly. It helps dissipate heat created by internal components and keep them from over-heating. The ATS-11H-24-C1-R0 is one of those components.
The ATS-11H-24-C1-R0 is a thermal heat sink designed for use in computers, gaming consoles, laptops, printers, cell phones, and other electronic devices. It is made of metal (such as aluminum or copper) and is installed between the processor and the case to dissipate heat generated by the processor.
The ATS-11H-24-C1-R0 has a number of features that make it well-suited for dissipating heat. First, it has a unique design that enables improved thermal conduction. This allows heat to be distributed evenly throughout the heat sink, resulting in a more efficient dissipation of heat. Second, the ATS-11H-24-C1-R0 has an open-loop structure with a base plate. This helps achieve better thermal contact with the case, allowing heat to transfer more rapidly. The combination of these features allows the ATS-11H-24-C1-R0 to dissipate heat much more quickly than other heat sinks.
The working principle of the ATS-11H-24-C1-R0 is based on the thermodynamics of heat flow. Heat is generated by the processor and travels to the heat sink, which is usually cooler than the processor. The heat is then dissipated to the surrounding air by using the heat sink\'s fins and open loop construction. This process is efficient because it allows the heat to be spread out over a larger area and dissipates quickly, thereby keeping the processor cool.
The ATS-11H-24-C1-R0 is an effective and reliable tool for keeping electronics cool. It is easy to install, as it usually comes with mounting hardware. Additionally, it is low-cost and provides excellent durability, making it a great choice for anyone looking to keep their electronics running at optimal temperatures.
In conclusion, the ATS-11H-24-C1-R0 thermal heat sink is an effective and reliable component for keeping electronics cool. Its unique design enables improved thermal conduction and open-loop structure with a base plate results in improved heat dissipation. Additionally, the working principle is based on the thermodynamics of heat flow, assisting in the efficient dissipation of heat.
The specific data is subject to PDF, and the above content is for reference