ATS-11H-32-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS-11H-32-C2-R0-ND

Manufacturer Part#:

ATS-11H-32-C2-R0

Price: $ 5.81
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X36.83X11.43MM T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11H-32-C2-R0 datasheetATS-11H-32-C2-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.22837
30 +: $ 4.93773
50 +: $ 4.64726
100 +: $ 4.35683
250 +: $ 4.06637
500 +: $ 3.77592
1000 +: $ 3.70330
Stock 1000Can Ship Immediately
$ 5.81
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 1.450" (36.83mm)
Diameter: --
Height Off Base (Height of Fin): 0.450" (11.43mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 21.46°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are essential components that ensure the proper functioning of many electronics components as they reduce their run temperatures and keep them cool. Thermal solutions such as heat sinks are used in many industries, including automotive products, communication systems, computers, and medical devices. The ATS-11H-32-C2-R0 heat sink is an important component in the family of thermal-heat sinks. It is designed to provide cooling solutions for microelectronic packaging applications.

This particular heat sink is constructed of aluminum and it has a corrosion resistant powder coating. It has the basic features of a thermal heat sink, including its compact size, superior thermal performance, and reliable operation. The height of the ATS-11H-32-C2-R0 is 32mm, and the base material is constructed from aluminum alloy. Also, the cooling fins are designed with optimization to maximize the dissipation of the heat.

The working principle of the ATS-11H-32-C2-R0 heat sink is based on the transfer of thermal energy from high temperature components to the environment. This is achieved by dissipating the thermal energy from the component into the external environment through the fins of the heat sink. This in turn allows the component to stay cool and operate properly.

The application fields of the ATS-11H-32-C2-R0 heat sink are numerous. It can be used in a variety of digital and analog circuits, including electronic application boards, power electronic semiconductors, and more. The thermal performance of this heat sink is also good, as it dissipates the thermal energy from the components at a steady rate. This makes it ideal for components that require longer run times and higher temperature parts, as it keeps them cool and performs reliably.

Overall, the ATS-11H-32-C2-R0 heat sink is an essential component in the thermal-heat sinks market. With its optimized design, superior performance, and reliable operation, it ensures that components have the adequate cooling they need to function properly and prevent damage. It is widely used in many industries for various digital and analog applications, making it a valuable thermal-heat sinks for many applications.

The specific data is subject to PDF, and the above content is for reference

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