| Allicdata Part #: | ATS20037-ND |
| Manufacturer Part#: |
ATS-11H-72-C2-R0 |
| Price: | $ 5.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11H-72-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.95810 |
| 10 +: | $ 4.82328 |
| 25 +: | $ 4.55540 |
| 50 +: | $ 4.28740 |
| 100 +: | $ 4.01946 |
| 250 +: | $ 3.75150 |
| 500 +: | $ 3.48354 |
| 1000 +: | $ 3.41655 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are systems designed to dissipate heat created by electrical components, usually transistors, semiconductors, and other active components. They are commonly used to reduce the temperature of electronic devices by transferring heat to the surrounding environment through convectional cooling. The ATS-11H-72-C2-R0 is a thermal-heat sink specific for integrated circuits and other surface mounted devices.
The ATS-11H-72-C2-R0 maximum heat sink size is 63mm x 11mm with diameter 2mm, with air flow near 0.067 cm3/s. The product is efficiently designed to transfer heat away from the device and deposit it on the surroundingenvironment, including air, liquid, and other mediums. The heat sink has a fan mounted at the bottom, which provides airflow that helps dissipate the heat from the device and into the environment.
The ATS-11H-72-C2-R0 datasheet provides various properties for the design of the heat sink including the material, temperature range when using the heat sink,finishing area,and heat dissipation rate. The product is suitable for most standard applications such as automotive, consumer, industrial, and commercial electronics.
The ATS-11H-72-C2-R0 works on a principle of convective cooling. This is done by placing a fan underneath the heat sink, which draws in air from the environment and passes it over the heat sink. This passing air absorbs the heat from the heat sink and transfers it away from the device and into the environment. The ATS-11H-72-C2-R0 product also uses natural convectionalinstead of forced convectional cooling, which is simply the effect of air moving naturally due to differences in temperature.
The purpose of the ATS-11H-72-C2-R0 heat sink is to maintain the temperature of the electronic devices below the maximum operating temperature. This is done by dissipating heat away from the device and providing adequate airflow to ensure that the temperature does not exceed the maximum recommended temperature. This is why the ATS-11H-72-C2-R0 heat sink is widely used in applications requiring cooling.
The ATS-11H-72-C2-R0 thermal-heat sink is ideal for devices that use integrated circuits and other surface mounted devices. It is designed to provide efficient heat dissipation and transfer heat away from the device and into the surrounding environment. The product is suitable for most applications where cooling is required, and provides an effective solution for devices operating at high temperatures. The ATS-11H-72-C2-R0 heat sink is a reliable and available solution for peripheral cooling solutions.
The specific data is subject to PDF, and the above content is for reference