| Allicdata Part #: | ATS-11H-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-11H-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11H-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11H-73-C1-R0 is a heat sink that is specifically designed for thermal-based applications. It is capable of dissipating heat from components by absorbing it as heat, and then dispersing it away from the system. This makes the ATS-11H-73-C1-R0 perfect for applications that involve high temperatures and require efficient cooling.
Applications
The ATS-11H-73-C1-R0 is widely used in a wide range of applications that require effective thermal management. It is particularly popular in high-performing electronics and automotive applications, as it is able to disseminate heat away from vulnerable components or systems in a way that maintains optimal performance. In addition to these applications, the ATS-11H-73-C1-R0 heat sink is also used in applications that involve RF components, where it helps ensure that excessive amounts of heat do not affect the integrity of delicate parts.
Features
The ATS-11H-73-C1-R0 heat sink features a unique hexagonal design that is ideal for optimally absorbing and dissipating heat. It is also designed with a small footprint that allows for simpler installation. Additionally, the heat sink has an airflow resistance of 0.18 °C/W, which helps improve cooling efficiency. Lastly, the ATS-11H-73-C1-R0 features a thermal resistance of 0.5 °C/W, which ensures that it can maintain a steady operation temperature under varied conditions.
Working Principle
The working principle behind the ATS-11H-73-C1-R0 is relatively simple. It uses a combination of thermal conductivity and convection to absorb and disperse heat away from the component in a controlled way. When internal heat is created, it is absorbed into the heat sink and then dissipated away from the component in the form of an airflow. The hexagonal structure of the heat sink helps to create an efficient path for the heat to travel.
The ATS-11H-73-C1-R0 also has a built-in fan that helps to further improve cooling efficiency. The fan blows air across the heat sink, which helps to better move the heat away from the component. For additional cooling efficiency, the ATS-11H-73-C1-R0 can be placed beneath a larger heat sink or cooling fan to help ensure that heat is dispersed away from the component even more effectively.
Conclusion
The ATS-11H-73-C1-R0 heat sink is an excellent choice for managing heat in a wide range of applications, as it has a small footprint, and is capable of absorbing and dissipating heat in an efficient manner. It is also designed to be easily installable on many different component systems. Additionally, the built-in fan helps to better distribute the heat away from the component, which can improve the safety of the system. The ATS-11H-73-C1-R0 is a highly effective thermal management solution that is perfect for any application where heat must be effectively managed.
The specific data is subject to PDF, and the above content is for reference