ATS-11H-76-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-11H-76-C3-R0-ND

Manufacturer Part#:

ATS-11H-76-C3-R0

Price: $ 3.51
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X25MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11H-76-C3-R0 datasheetATS-11H-76-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.18591
30 +: $ 3.09981
50 +: $ 2.92774
100 +: $ 2.75549
250 +: $ 2.58325
500 +: $ 2.49714
1000 +: $ 2.23882
Stock 1000Can Ship Immediately
$ 3.51
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is essential for modern electronics, providing proper heat transfer from a heat source to a heat sink. ATS-11H-76-C3-R0 is a high-performance thermal solution that is designed to provide efficient heat transfer for a variety of applications. The ATS-11H-76-C3-R0 is a heat sink with an aluminum core for excellent conductivity, a C3-R0 powder-coated frame for high thermal stability, and a 76 mm × 76 mm aluminum extrusion for maximum dispersal of heat. This combination of components makes the ATS-11H-76-C3-R0 an excellent choice for applications requiring efficient heat transfer solutions.

The ATS-11H-76-C3-R0 heat sink is designed to be used in a variety of applications, including industrial robotics, smart home appliances, drones, medical imaging systems, and other scenarios where efficient thermal management is required. This heat sink is particularly well-suited to applications that require constant high heat transfer rates from a heat source to the external atmosphere to maintain optimal system performance in an efficient manner.

The ATS-11H-76-C3-R0 is designed to operate based on convection and thermal conduction. Convection occurs when hot air from the heat source is drawn away from the heat source and replaced by cooler air from the external environment. This creates an air current that carries heat away from the heat source, cooling the latter. Thermal conduction is the second method employed by the ATS-11H-76-C3-R0. In this case, heat is transferred from the heat source to the aluminum core of the heat sink which is then cooled by the external environment. This combination of convection and thermal conduction allows the ATS-11H-76-C3-R0 to operate efficiently and transfer large amounts of heat away from the heat source.

The ATS-11H-76-C3-R0 has an extended thermal impedance range, making it well-suited to high-performance applications. It has a thermal resistance of 0.10-0.25°C/W and a thermal conductivity of about 180-195 W/mK, allowing it to operate at a wide range of temperatures. The ATS-11H-76-C3-R0 is particularly well-suited to applications where high heat transfer rates and operating temperatures are required. The extended thermal impedance range of the ATS-11H-76-C3-R0 also ensures that it will remain efficient even as the operating temperature increases.

The ATS-11H-76-C3-R0 is a reliable and efficient thermal solution that is designed to provide superior heat transfer for a variety of applications. Its combination of aluminum core, C3-R0 powder-coated frame, and 76 mm × 76 mm aluminum extrusion make it a highly efficient heat sink that can handle constant high heat transfer rates. The extended thermal impedance range of the ATS-11H-76-C3-R0 also ensures that it will remain efficient even as the operating temperature increases. As such, the ATS-11H-76-C3-R0 is an excellent choice for industrial robotics, smart home appliances, drones, medical imaging systems, and other applications requiring efficient thermal management.

The specific data is subject to PDF, and the above content is for reference

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