ATS-11H-85-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-11H-85-C3-R0-ND

Manufacturer Part#:

ATS-11H-85-C3-R0

Price: $ 3.65
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X10MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11H-85-C3-R0 datasheetATS-11H-85-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.31695
30 +: $ 3.22707
50 +: $ 3.04781
100 +: $ 2.86858
250 +: $ 2.68930
500 +: $ 2.59965
1000 +: $ 2.33071
Stock 1000Can Ship Immediately
$ 3.65
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 24.11°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-11H-85-C3-R0 thermal heat sink is a type of heat sink that controls the temperature of a surface by dissipating the heat away from the device that is generating it. A thermal heat sink is used when the device is generating too much heat to be managed by the regular cooling systems or when the device needs a higher temperature to properly operate. The ATS-11H-85-C3-R0 thermal heat sink is made from aluminum and has a cylindrical shape. It is designed to transfer heat away from the source quickly and efficiently. It is also designed to be easy to install.

The ATS-11H-85-C3-R0 thermal heat sink works by transferring heat away from the device. Heat is conducted from the device through the aluminum material of the heat sink. The material of the heat sink acts as a conduit for heat. As the heat is transferred from the device it is then dissipated by radiation, convection, and conduction. Radiation is when heat is dissipated into the atmosphere. Convection is when heat is conducted away from the device as air moves across the heat sink. Conduction is when heat is conducted directly from the device to the heat sink. All three of these methods of dispersing heat make the ATS-11H-85-C3-R0 thermal heat sink an effective way of cooling devices.

The ATS-11H-85-C3-R0 thermal heat sink is designed for use in a broad variety of applications. It is most commonly used in consumer electronics such as televisions, computers, game consoles, and audio equipment. It is also used in industrial applications such as in laser systems and electronic ovens. It is also used in automotive applications such as in car audio systems and in commercial applications such as in refrigerators and freezers. The ATS-11H-85-C3-R0 thermal heat sink is designed to work in a wide range of operating temperatures ranging from -20°C to +105°C.

The ATS-11H-85-C3-R0 thermal heat sink is an effective way of controlling the temperature of electronic devices. It works by dissipating heat away from the device so that it does not become too hot. This allows the device to operate normally and efficiently. The ATS-11H-85-C3-R0 thermal heat sink is also easy to install and is designed for a variety of applications. This makes it an ideal choice for anyone looking to keep their devices running cool and efficiently.

The specific data is subject to PDF, and the above content is for reference

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