ATS-11H-97-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.30°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat sinks, or heatsinks, are physical components which absorb and dissipate heat from other components in a system. Heat sinks are widely used in a variety of applications and are an essential component used to moderate temperatures in these types of applications. The ATS-11H-97-C2-R0 is an example of a thermal heat sink used in many different applications. In this article, we will discuss the characteristics of this particular model and its fields of application, as well as the working principle of the ATS-11H-97-C2-R0.

Characteristics Of ATS-11H-97-C2-R0 Thermal Heat Sink

The ATS-11H-97-C2-R0 is a thermal heat sink that is rated to handle high temperatures inevitably especially in over-clocked computer systems, server, and telecom systems. The thermal performance of the ATS-11H-97-C2-R0 is composed of several features including large copper fin base, high-performance aluminum heat sink and copper fins. The base has a large surface area, which increases the rate of heat transfer from the component it is mounted on, and the aluminum heat sink helps dissipate the heat away from the base so that it can be cooled faster. The copper fin design also allows for more efficient cooling due to the increased surface area over which heat can be dissipated. Furthermore, the copper fins are also quite efficient at transferring heat from the base to the surroundings, making the ATS-11H-97-C2-R0 a highly efficient heat sink.

Application Field Of ATS-11H-97-C2-R0 Thermal Heat Sink

The ATS-11H-97-C2-R0 thermal heat sink is suitable for a wide range of applications. It is particularly suitable for use in computers, telecommunication systems, and other electronic equipment. It is designed to dissipate high temperatures in overclocked systems, server, and telecom systems. It can be used with low-profile components such as CPU, graphic cards, and memory to regulate temperatures and prevent damage to components from overheating.

Working Principle Of ATS-11H-97-C2-R0 Thermal Heat Sink

The working principle of the ATS-11H-97-C2-R0 thermal heat sink is quite simple. It works by conducting heat away from the component it is mounted on, and dissipating it away from the base through the aluminum heat sink and copper fins. The large surface area of the base helps to increase the rate of heat transfer and the efficient design of the aluminum heat sink and copper fins allows for excellent heat dissipation, thus ensuring that the components remain cool despite high temperatures.

Conclusion

The ATS-11H-97-C2-R0 thermal heat sink is an excellent heat sink for a variety of applications including computers, telecommunication systems, and other electronic equipment. It is capable of dissipating high temperatures and thus prevents components from suffering damage from overheating. Its large copper fin base helps to increase the rate of heat transfer, and its aluminum heat sink and copper fins allow for efficient heat dissipation. This makes the ATS-11H-97-C2-R0 an excellent heat sink for any application.

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