| Allicdata Part #: | ATS-12A-144-C1-R0-ND |
| Manufacturer Part#: |
ATS-12A-144-C1-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12A-144-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.19788 |
| 30 +: | $ 3.11157 |
| 50 +: | $ 2.93857 |
| 100 +: | $ 2.76576 |
| 250 +: | $ 2.59291 |
| 500 +: | $ 2.50647 |
| 1000 +: | $ 2.24717 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Introduction to ATS-12A-144-C1-R0
ATS-12A-144-C1-R0 is a high performance heat sink designed for industrial use. It is designed to dissipate thermal energy generated by electronic components and help keep vital systems and components cool. The heat sink is made of aluminum alloy and is designed with optimized thermal efficiency. It is a lightweight, reliable and cost-effective solution for cooling a variety of electronic components, as well as entire systems.
Application Fields
ATS-12A-144-C1-R0 heat sink is designed for use in a variety of industry verticals and applications. It is commonly used in automotive, medical, railway, telecommunications, aerospace, computer, laser, industrial automation, and any other electronic equipment or system requiring thermal management. It is also suitable for use in 3D printer applications, DC/DC converter power supplies, LED lighting, and other high-power, high-efficiency, or ultra-low-cost products.
Working Principle
The working principle of the ATS-12A-144-C1-R0 heat sink is based on the natural process of heat conduction. Heat is conducted from the component or system to the heat sink where it is dissipated away from the component or system. It works effectively by dissipating heat away from the component or system using natural thermal principles, such as convection and conduction.
The ATS-12A-144-C1-R0 heat sink is made of a highly efficient and effective aluminum alloy. This alloy is designed to effectively and rapidly dissipate heat away from electronic components and systems. Its ribs and fins are designed to allow greater exposure of the walls to the surrounding air, increasing its surface area and the rate of heat transfer away from the component or system.
The heat sink also uses a fan, which helps force hot air away from the component or system, while drawing in cooler air to reduce the temperature of the component or system. In addition, the fan also helps reduce the noise levels associated with the device. The fan and the aluminum alloy material used in the heat sink are designed to have low vibration and low sound levels, making it perfect for industrial and other noise sensitive applications.
Conclusion
The ATS-12A-144-C1-R0 heat sink is a high quality thermal management solution designed for use in a variety of industries and applications. It uses innovative aluminum alloy materials, which are designed to effectively and rapidly dissipate heat away from electronic components and systems. It is also designed with optimized thermal efficiency and is a lightweight, reliable and cost-effective solution for cooling a variety of electronic components, as well as entire systems. By combining convection and conduction principles, and using a fan to force hot air away from the component or system, the ATS-12A-144-C1-R0 heat sink is the perfect choice for thermal management applications.
The specific data is subject to PDF, and the above content is for reference