ATS-12A-147-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-12A-147-C1-R0-ND

Manufacturer Part#:

ATS-12A-147-C1-R0

Price: $ 3.37
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X10MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12A-147-C1-R0 datasheetATS-12A-147-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.05550
30 +: $ 2.97276
50 +: $ 2.80753
100 +: $ 2.64235
250 +: $ 2.47724
500 +: $ 2.39466
1000 +: $ 2.14693
Stock 1000Can Ship Immediately
$ 3.37
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.48°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks: Application Field and Working Principle of ATS-12A-147-C1-R0

Thermal - heat sinks are essential components for thermoelectric and cooling applications, and the ATS-12A-147-C1-R0 is one of the most widely used in these fields. Designed for medium-to-high power applications, this heat sink offers high cooling performance in both air-cooled and water-cooled setup, making it a great choice for a variety of applications.The ATS-12A-147-C1-R0 is designed to improve heat dissipation capacity, and offers high thermal conductivity, which is ideal for power electronics and cooling applications. It is constructed from high-quality aluminum, with a finned design for maximum heat dissipation. The fins on the ATS-12A-147-C1-R0 are spaced apart and bonded together at their base allowing for a higher surface area and better heat dissipation.When used in a thermal application, the ATS-12A-147-C1-R0 works by dissipating heat away from the heated components to the surrounding environment. Heat is transferred from the device to the heat sink through conduction and convection. Conduction is the transfer of heat between two objects that are in direct contact. Convection is the transfer of heat between an object and its surrounding environment.The ATS-12A-147-C1-R0 can be used in various applications, such as: power electronics, lighting systems, cooling systems, transistor circuits, and more. It is also a great choice for automotive applications, as it is engineered with a universal design. Its lightweight aluminum construction makes it highly resistant to corrosion and is able to withstand harsh environments.The ATS-12A-147-C1-R0 provides high-quality cooling and works by utilizing a combination of air and aluminum fins. Air is circulated through the fins, and the aluminum fins disperse the air evenly over the entire surface of the device, allowing for an optimal amount of heat dissipation. This also ensures that the device does not overheat, and operates safely. The aluminum fins also provide additional thermal mass, allowing the heat to dissipate over a longer period of time.Heat sink technology is essential for controlling the temperature of electronics devices. The ATS-12A-147-C1-R0 is a great choice for medium-to-high power electronics cooling applications, as it offers high performance and thermal efficiency. Its construction allows for maximum heat dissipation and prevents device overheating, making it a great choice for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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