| Allicdata Part #: | ATS20129-ND |
| Manufacturer Part#: |
ATS-12A-15-C2-R0 |
| Price: | $ 4.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12A-15-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.11390 |
| 10 +: | $ 4.00239 |
| 25 +: | $ 3.77975 |
| 50 +: | $ 3.55748 |
| 100 +: | $ 3.33509 |
| 250 +: | $ 3.11275 |
| 500 +: | $ 2.89041 |
| 1000 +: | $ 2.83483 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an important tool for controlling heat, and the ATS-12A-15-C2-R0 is no exception. Offering superior heat dissipation through its Thermal Clad construction, the ATS-12A-15-C2-R0 is a powerful solution for both large and small electronics applications.
Heat sinks are a type of passive thermal management device. They’re designed to transfer the heat generated by an electronic component into the environment, away from the component, so as to keep the component working at a safe temperature. In order for a heatsink to function properly, it must be made of materials that dissipate heat quickly and efficiently, such as aluminum or copper.
The ATS-12A-15-C2-R0 is a type of thermal clad heatsink, one that’s designed with a combination of aluminum and copper fins for superior heat dissipation. The unique engineering of the thermal clad construction provides an effective solution for a wide variety of electronic applications, including semiconductor power transistors, switching power supplies, and motor controllers.
This particular heatsink utilizes an extruded heatsink body with thermally conductive adhesive layers. The layers are designed to increase the overall surface area of the heat sink, thus providing an even more efficient way of transferring the heat away from the component and into the environment. The heat sink also features two channeled fins, designed for an additional increase in surface area and thermal efficiency.
The heat sink also comes with multiple mounting options, including a adjustable mounting bracket or multiple studded arrangements. This allows for flexible installation options and is perfect for applications where space is limited. The options also make the heatsink suitable for both horizontal and vertical mounting.
In terms of performance, the ATS-12A-15-C2-R0\'s thermal clad construction offers superior heat dissipation, making it an efficient tool for dealing with the high temperatures generated by electronic components. This makes it perfect for applications where the component is subject to high electrical loads or temperatures.
Overall, the ATS-12A-15-C2-R0 is an ideal choice for small and large electronic applications, offering an efficient and cost-effective solution for heat dissipation. Its thermal clad construction ensures superior heat dissipation, and its multiple mounting options make it suitable for nearly any setup.
The specific data is subject to PDF, and the above content is for reference