| Allicdata Part #: | ATS-12A-15-C3-R0-ND |
| Manufacturer Part#: |
ATS-12A-15-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12A-15-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are integral in the operation of any electrical system. This doesn\'t just apply to larger systems, such as those found in factory, but to systems of all sizes. Even the smallest of systems can benefit from the use of thermal management techniques, especially those of the Heat Sink variety. The ATS-12A-15-C3-R0 Heat Sink is one such system that can help maintain efficient and safe operation temperatures for electronic components.
The ATS-12A-15-C3-R0 Heat Sink is a low-profile heat sink made of high-grade aluminum with a black anodized finish. This heat sink features a profiled base and is designed to provide excellent heat dissipation and airflow. It also has an expansive fin area and multiple mounting holes to simplify installation. The heat sink is suitable for a variety of temperatures and environments, making it widely applicable for many applications.
The primary purpose of the ATS-12A-15-C3-R0 Heat Sink is to keep electronic components from overheating through the process of heat dissipation. As the heat generated by components is transferred to the heat sink, it is cooled down and dissipated via the fin design. The heat is then moved away from the components, making sure that they remain safe and operate at the intended temperatures and levels of efficiency.
The ATS-12A-15-C3-R0 Heat Sink is suitable for a wide array of applications, ranging from industrial to consumer electronics. It is mainly used in power amplifiers, power supplies, and in high-power transistors. It is also used in the thermal management of sensitive components, such as microprocessors and multi-layer circuit boards. Additionally, the ATS-12A-15-C3-R0 Heat Sink can be used in medical devices, as well as in aerospace and military applications.
In addition to the ATS-12A-15-C3-R0 Heat Sink’s ability to dissipate heat, it is also designed to provide electromagnetic compatibility. Its aluminum construction blocks both EMI and RFI, preventing the components from receiving interference. By using the ATS-12A-15-C3-R0 Heat Sink, components will have enhanced performance and robust signal integrity.
The ATS-12A-15-C3-R0 Heat Sink is a reliable and affordable heat sink that can be used in a variety of applications. Its low profile design, high-grade aluminum construction, and easy installation make it a great choice for any system. Its ability to dissipate heat and provide electromagnetic compatibility makes it suitable for more sensitive applications and components. With its versatile nature, the ATS-12A-15-C3-R0 Heat Sink is a great choice for any thermal management solution.
The specific data is subject to PDF, and the above content is for reference