ATS-12A-161-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-12A-161-C3-R0-ND

Manufacturer Part#:

ATS-12A-161-C3-R0

Price: $ 4.41
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X20MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12A-161-C3-R0 datasheetATS-12A-161-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.96711
30 +: $ 3.74703
50 +: $ 3.52661
100 +: $ 3.30618
250 +: $ 3.08577
500 +: $ 2.86535
1000 +: $ 2.81025
Stock 1000Can Ship Immediately
$ 4.41
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.82°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are essential components of many modern everyday appliances. They are used to dissipate the heat produced by electronic components to maintain their operational temperature and prolong their life. The ATS-12A-161-C3-R0 is a specialized thermal - heat sink designed to effectively dissipate heat from microprocessors or other electronic components.

The ATS-12A-161-C3-R0 consists of a base metal material such as aluminum or copper, which is connected to a fan that can draw hot air away from the electronic component. The base material is designed in a way to maximize airflow and ensure efficient heat dissipation by providing thermal resistance along the entire length of the heat sink. Heat is transferred from the component to the base material through conduction and then dispersed efficiently by the fan. The fan speed and temperature can be adjusted to create the desired cooling levels.

The ATS-12A-161-C3-R0 has a wide range of applications ranging from providing cooling to high-performance processors, graphic cards, gaming systems to cooling large industrial machines. It can be used in desktop computers, printers, industrial computers, servers, hard drives, televisions, refrigeration systems, and other consumer appliances. It can be used to prevent the electronic components from overheating and is especially useful in places with tight space confines.

The ATS-12A-161-C3-R0 is designed with a strong base structure, low profile design, and high airflow through the cooling fins. This allows for a steady and efficient flow of air which ultimately leads to better heat dissipation and improved cooling performance. The cooling fins also feature a material that is resistant to oxidation to ensure a longer operational life of the heat sink. Additionally, the fan speed is adjustable to meet the cooling needs of different electronic components.

The ATS-12A-161-C3-R0 can be used in any environment where cooling is needed. It is effective in both hot and cold temperatures, making it a versatile solution for users in various industries. Its low profile design allows for easy installation and maintenance, and the fan speed can be adjusted easily too. This specialized thermal – heat sink is sure to provide reliable cooling performance for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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