| Allicdata Part #: | ATS20151-ND |
| Manufacturer Part#: |
ATS-12A-17-C2-R0 |
| Price: | $ 4.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12A-17-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.13910 |
| 10 +: | $ 4.02507 |
| 25 +: | $ 3.80167 |
| 50 +: | $ 3.57802 |
| 100 +: | $ 3.35437 |
| 250 +: | $ 3.13075 |
| 500 +: | $ 2.90712 |
| 1000 +: | $ 2.85122 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important consideration in electronics systems, especially in applications that involve heat sources such as CPUs, GPUs, and memory devices. Heat sinks are often used to manage and dissipate the excessive heat, and the ATS-12A-17-C2-R0 thermal-heat sink is one such device. This article provides an overview of the application field and working principle of the ATS-12A-17-C2-R0 thermal-heat sink.
The ATS-12A-17-C2-R0 thermal-heat sink is designed for cooling and providing reliable performance in both commercial and industrial applications. This device is compatible with a wide range of processor and memory chips. It is a low-profile heat sink that provides efficient thermal management and is suitable for space-restricted environments. The ATS-12A-17-C2-R0 thermal-heat sink is also able to operate smoothly under harsh environmental conditions, such as temperature ranges from -20°C to 200°C.
In terms of the working principle, the ATS-12A-17-C2-R0 thermal-heat sink utilizes the heat pipe technology. The cold plate of the heat sink is connected to the heat pipes with high-conductivity aluminum foil. The heat pipes are filled with a special liquid which has a boiling point much lower than the actual operating temperature. When the cold plate is in contact with a heat source such as a combined CPU/GPU count, the heat-transfer liquid evaporates at the hot spot, releasing its thermal energy to the cold plate. The evaporated vapor then passes through the heat pipe to a condensation area where it condenses and releases its latent heat of vaporization. This process can provide even, efficient cooling of the heat source. In addition, the heat pipes are filled with non-toxic and non-flammable working fluids, providing an environmentally conscious solution to thermal management.
The ATS-12A-17-C2-R0 thermal-heat sink can be used in many different applications, including data center cooling, automotive electronics, industrial control systems, and telecommunications equipment. It is also suitable for medical devices, LCD displays, and PCs. The device can provide an efficient and cost-effective solution for companies that require reliable thermal management solutions.
In conclusion, the ATS-12A-17-C2-R0 thermal-heat sink is a reliable and efficient device that can be used in many different applications. It utilizes the heat pipe technology to provide even, efficient cooling of a variety of heat sources. It is compatible with a wide range of processor and memory chips, is low profile, and operates smoothly in harsh environmental conditions. The ATS-12A-17-C2-R0 thermal-heat sink is suitable for companies that require an efficient and cost-effective solution to thermal management.
The specific data is subject to PDF, and the above content is for reference