| Allicdata Part #: | ATS-12A-178-C3-R0-ND |
| Manufacturer Part#: |
ATS-12A-178-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12A-178-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are important components in modern electronic products. The term heat sink refers to any device that is used to dissipate heat generated by electrical or mechanical components. The melting of plastic, heat lossto the atmosphere, and other energy losses can be prevented by properly selecting and installing a heat sink. The ATS-12A-178-C3-R0 is a type of aluminum heat sink designed for efficient thermal management.
Applications of ATS-12A-178-C3-R0 Heat Sinks
The ATS-12A-178-C3-R0 is a general-purpose heat sink that can be used in a wide variety of applications. It can be used to help cool down CPUs, GPUs, ASICs, FPGAs, memory chips, power transistors, and many other integrated circuits. In addition, it can also be used to help manage the heat from various consumer products such as refrigerators, air conditioners, and gasoline engines.
The ATS-12A-178-C3-R0 is designed with a highly efficient thermal conductivity which is achieved through the use of extruded aluminum fins, allowing for greater heat exchange between the heat sink and the surrounding air. Additionally, the heat sink also has four mounting holes, three screws, and a 22.86 mm x 11.43 mm opening that allows for easy attachment to most motherboards. Its low profile design and natural anodized finish ensures a perfect fit.
Working Principle of ATS-12A-178-C3-R0 Heat Sinks
Heat sinks work by transferring thermal energy from a hot surface to the surrounding air. The ATS-12A-178-C3-R0 heat sink has an Aluminum base, with a 25mm thick extruded aluminum fins that effectively turn the heat sink into a large expansible surface. Heat is conducted along the base of the fins and transferred to the fins. From there, convection currents of air generated by airflow through the finned surface, carry the heat away.
To ensure maximum heat transfer, the fins can be lapped by hand or by a machine in a controlled environment. This ensures an even temperature distribution, as well as a greater thermal conductivity. Additionally, a heat sink with an optimized lapped surface can also operate at higher temperatures and provide better cooling performance.
Conclusion
The ATS-12A-178-C3-R0 is an aluminum heat sink designed for efficient thermal management. Its low profile design, natural anodized finish, and efficient thermal conductivity make it a great choice for cooling electronic components. The heat sink has four mounting holes, three screws, and a 22.86 mm x 11.43 mm opening, allowing for easy installation. The fins can be lapped for optimum performance. With proper installation and maintenance, the ATS-12A-178-C3-R0 provides superior cooling capabilities.
The specific data is subject to PDF, and the above content is for reference