| Allicdata Part #: | ATS-12A-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-12A-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12A-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a key factor in determining the performance of any system, and heat sinks are often used to dissipate heat from electronic components. ATS-12A-20-C1-R0 is a popular heat sink designed for thermal management in a wide variety of applications. This article will discuss the application field and working principle of the ATS-12A-20-C1-R0 heat sink.
The ATS-12A-20-C1-R0 heat sink is designed for use in telecommunication, server, medical, and industrial applications. It is also suitable for areas with high ambient temperatures and can dissipate up to 200W of heat from electronic components. The heat sink features a 12\'\'x12• x20\'\' extruded aluminum fin array with a groove pattern that increases surface area for increased heat transfer. The base is made of copper and has a highly polished finish for efficient heat transfer and durability. The slotted design allows for ease of installation and mounting. The ATS-12A-20-C1-R0 heat sink is UL/RoHS certified and is backed by a 3-year warranty.
The working principle of the ATS-12A-20-C1-R0 heat sink revolves around the process of thermodynamics. Heat is generated from the electronic components and is transferred through the thermal interface material to the heat sink in the form of conduction. The fin array of the heat sink then increases the surface area for maximum heat dissipation, as the surface area increases the amount of heat that can be dissipated also increases. The fin pattern also increases surface area for increased heat dissipation. The heat generated is then dissipated to the surrounding atmosphere by convection. Convection is the process of hot air rising away from the heat sink and being replaced by cooler air.
The ATS-12A-20-C1-R0 heat sink is a popular choice for thermal management in a wide variety of applications due to its efficient design and effective heat dissipation. The grooved fin array increases the surface area for increased thermal efficiency, while the copper base has a highly polished finish for efficient heat transfer and durability. In addition, the slotted design allows for ease of installation and mounting. The heat sink is UL/RoHS certified and is backed by a 3-year warranty, so users can be confident that it will perform reliably under a wide variety of conditions.
The specific data is subject to PDF, and the above content is for reference