| Allicdata Part #: | ATS20188-ND |
| Manufacturer Part#: |
ATS-12A-203-C2-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12A-203-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.83040 |
| 10 +: | $ 3.72456 |
| 25 +: | $ 3.51767 |
| 50 +: | $ 3.31065 |
| 100 +: | $ 3.10376 |
| 250 +: | $ 2.89684 |
| 500 +: | $ 2.68992 |
| 1000 +: | $ 2.63820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that help to maintain the efficient operation of electrical and electronic components. They help to protect components by releasing their heat to the atmosphere and keeping them from overheating. ATS-12A-203-C2-R0 is a specific type of heat sink that has been designed to provide maximum thermal performance for various applications.
The ATS-12A-203-C2-R0 heat sink features a large fin structure. This fin structure is designed to ensure that a maximum amount of thermal dissipation is achieved, allowing for efficient cooling of components. The fins are also designed to maximize air contact, which further boosts thermal efficiency. The heat sink is composed of aluminum alloy, which is an excellent choice for thermal management applications as it is lightweight, strong, and corrosion-resistant.
The superior thermal performance of the ATS-12A-203-C2-R0 is made possible by its unique design. The heat sink has a solid base with a large narrow surface that has several holes drilled in it. These holes serve to provide an additional air flow, which helps to keep the components cool. This air flow is further enhanced by the large surface area of the device, which helps to dissipate heat quickly. The design also features an angled section to increase surface area and reduce air turbulence, further increasing the thermal performance of the device.
One of the main applications of the ATS-12A-203-C2-R0 is for cooling computer processors. The large fin structure of the device helps to maximize heat dissipation, allowing for a cooler and more efficient operation of the processor. The heat sink is also used in amplifiers, power amplifiers, and other devices that generate large amounts of heat. Due to its superior thermal performance, the device can easily be used to keep these components operating efficiently without experiencing thermal shut-down or other thermal issues.
The ATS-12A-203-C2-R0 also has excellent cooling capabilities for higher wattage components, such as those used in gaming consoles. The device is designed to take advantage of its larger surface area and angled profile to allow for maximum cooling performance. It is also more capable of handling airflow turbulence due to its angled profile, which further increases its cooling capabilities.
The working principle of the ATS-12A-203-C2-R0 is simple. The fins are designed to help redirect airflow over the cooling surface, which helps to dissipate heat quickly. The heat is then dispersed to the atmosphere, keeping the components cool. By having a large surface area and using an angled profile, the device can take advantage of the flow of ambient air in the environment, further aiding in the cooling process.
In conclusion, the ATS-12A-203-C2-R0 is an excellent heat sink that is designed to provide superior thermal efficiency. The device is capable of cooling a variety of electrical and electronic components, such as computer processors and gaming consoles, due to its large fin structure, angled profile, and large surface area. The angled profile further provides the device with superior cooling capabilities, allowing for maximum heat dissipation and a cooler operating environment for components. Thanks to its versatile design and high-performance capabilities, the ATS-12A-203-C2-R0 is a great choice for thermal management applications.
The specific data is subject to PDF, and the above content is for reference