| Allicdata Part #: | ATS-12A-23-C3-R0-ND |
| Manufacturer Part#: |
ATS-12A-23-C3-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12A-23-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are designed to manage heat generated by electrical components such as transistors, ICs, and other similar electronics. The ATS-12A-23-C3-R0 Heat Sink is one such device that can effectively transfer the heat generated by these components away from them and to an external source, such as air or water. The function of heat sinks is to provide an effective path for thermal energy from the component to the external environment. The ATS-12A-23-C3-R0 Heat Sink is a compact embedded thermal solution offering improved thermal performance compared to some of the older heat sink solutions.
The ATS-12A-23-C3-R0 Heat Sink is constructed from an aluminum extrusion with a stamped fins, bonded on the inside of the extrusion. This design provides an increased surface area that allows for maximum cooling efficiency. The ATS-12A-23-C3-R0 Heat Sink incorporates a three-dimensional design for improved thermal dynamics in order to ensure optimal airflow and a better thermal capacity when compared to its two-dimensional counterparts. It also features a patented pinned contact system for improved thermal performance.
In addition to cooling, the ATS-12A-23-C3-R0 Heat Sink also provides several features that can be beneficial in an application. One of these features is its ability to provide a gradual conduction of heat to the environment. Because of its three-dimensional design, the ATS-12A-23-C3-R0 Heat Sink has a greater ability to spread the heat across its entire surface area, which helps to distribute the generated thermal load more evenly, thereby allowing for a more gradual transfer of heat. The three-dimensional design also helps to reduce the overall operating temperature of the field components, which can help to significantly improve their lifetime.
The ATS-12A-23-C3-R0 Heat Sink is also designed to be mounted in place using a snap-in clip mechanism, which is easy to install and secure. This makes the ATS-12A-23-C3-R0 Heat Sink a popular choice for applications that may require some flexibility in the device\'s mounting position. Furthermore, the ATS-12A-23-C3-R0 Heat Sink is designed to be corrosion-resistant, and its lightweight construction makes it well-suited to applications in which weight is restricted, such as personal medical electronics.
In short, the ATS-12A-23-C3-R0 Heat Sink is an effective thermal management solution for field applications requiring improved thermal performance and corrosion resistance. Its three-dimensional design allows for improved thermal dynamics, which increases the heat dissipation rate, thus providing greater overall thermal control. Furthermore, its compact design, in addition to its ease of installation and lightweight construction, make the ATS-12A-23-C3-R0 Heat Sink a popular choice for embedded thermal applications.
The specific data is subject to PDF, and the above content is for reference