| Allicdata Part #: | ATS-12A-25-C1-R0-ND |
| Manufacturer Part#: |
ATS-12A-25-C1-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12A-25-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.32621 |
| 30 +: | $ 4.08555 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat sinks are essential components in the cooling systems of many electronic components due to their ability to dissipate heat generated by the components they cool. The ATS-12A-25-C1-R0 heat sink is an efficient heat-dissipating solution suitable for a variety of applications.
The ATS-12A-25-C1-R0 heat sink is constructed from aluminum with a black anodized finish and a high-temperature epoxy coating for increased durability and resistance to corrosion. It is designed with a uniquely shaped fin array that maximizes surface area to increase the heat dissipation capability of the unit. The fins are also specially angled to maximize air-flow and reduce air pressure drop to ensure efficient cooling. The ATS-12A-25-C1-R0 is capable of dissipating heat at higher airflows than traditional heat-sinks.
The ATS-12A-25-C1-R0 heat sink can be used in a variety of applications. It is ideal for microprocessor applications as it is able to efficiently dissipate the heat generated by the processor. It is also suitable for other cool equipments such as radiators, amplifiers, video cards, fan controllers, and power supplies. The heat sink can be installed in both horizontal and vertical configurations and is designed to fit into tight spaces such as enclosures and cabinets.
The ATS-12A-25-C1-R0\'s working principle is quite simple. As a current passes through the device, the heat generated is dissipated through the fins on the heat sink. As air passes over the fins, the heat is absorbed by it and dissipated through convection into the surrounding air. This process allows the device it is cooling to maintain a stable and safe temperature.
The ATS-12A-25-C1-R0 heat sink is a reliable and efficient way to dissipate heat away from delicate electronic components. It is a great solution for those looking for an efficient and cost-effective solution for cooling their devices. With its unique fin design and construction, it is sure to be a reliable and long-lasting solution.
The specific data is subject to PDF, and the above content is for reference